Unraveling Surface Scattering Mechanisms in Hydrogen-Terminated Diamond/MoO3 Heterostructures: A Theoretical Investigation
Source abstract
Abstract
Surface transfer doping addresses diamond’s doping challenges by enabling a two-dimensional hole gas (2DHG) in hydrogen-terminated diamond (H-diamond) through electron transfer to high-electron-affinity acceptors, such as molybdenum trioxide (MoO 3 ). While prior studies optimized 2DHG density, the mechanisms limiting carrier mobility remain unresolved. Here, we present a theoretical framework to quantify the impact of acoustic phonon, surface roughness, and surface impurity scattering on hole mobility in H-diamond/MoO 3 heterostructure (∼10 13 cm –2 ). First-principles calculations demonstrate that surface roughness dominates mobility degradation, reducing it from 10 3 to 10 2 cm 2 /(V s) compared to phonon-only cases, while surface impurities further suppress mobility (MoO 3 and HCO 3 yield the highest and lowest mobilities of ∼220 and 166 cm 2 /(V s), respectively). Total calculated hole mobility (∼200 cm 2 /(V s)) aligns with experimental ranges, with roughness heights (Δ = 0.18–0.35 nm) and impurity densities ( n imp 2 D = 4.32 × 10 13 cm − 2 ) identified as critical factors. These findings establish that mitigating interfacial surface roughness and suppressing adsorbates are essential for optimizing diamond-based devices, providing actionable strategies to enhance high-power diamond electronic performance.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic and Structural Properties of Oxides · Diamond and Carbon-based Materials Research · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
State Key Laboratory of Precision and Intelligent Chemistry, School of Chemistry and Material Sciences, and Collaborative Innovation Center of Chemistry for Energy Materials (iChEM)
University of Science and Technology of China
National Key Laboratory of Solid-State Microwave Devices and Circuits
Hebei Semiconductor Research Institute
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