Reduction of residual stress in montmorillonite/epoxy compounds
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Abstract
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Research context
OpenAlex topics: Epoxy Resin Curing Processes · Silicone and Siloxane Chemistry · Mechanical Behavior of Composites
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References (20)
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11. A. Akelah, P. Kelly, S. Qutubuddin and A. Moet, Clay Miner. submitted.
12. “Epoxy Curing Agents Data Sheet-Versamid 140 Polyamide Resins”, Henkel Corp, Polymers Div., 1990.
13. ASTM C-978-87, “Standard Test Method for Photoelastic determination of Residual Stress in a Transparent Glass Matrix Using a Polarizing Microscope Optical Retardation Compensation Procedures” 1989 Annual Book of ASTM Standards, 15.02 (American Society for Testing and Materials, Philadelphia, PA, 1989).
14. ASTM D-4093-86, “Standard test Method for Photoelastic Measurements of Birefringence and Residual Strains in Transparent or Translucent Plastic Materials”, 1989 Annual Book of ASTM Standards, 8.03 (American Society for Testing and Materials, Philadelphia, PA, 1989).
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16. K. A. Jockisch and S. A. Brown, in Transactions of the Annual Meeting of Society for Biomaterials in Conjunction with the International Biomaterials Symposium”, May 1–5, 1991, Scottsdale, AZ, 14 edited by P. J. Russell, vol. 14 (Society for Biomaterials, Algonquin, IL, 1991) p. 217.
17. ASTM D-790M-86, “Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials (Metric)” 1989 Annual Book of ASTM Standards, 8.02 (American Society for Testing and Materials, Philadelphia, PA, 1989).
18. P. Kelly, A. Akelah, S. Qutubuddin and A. Moet, Clays Clay Miner. submitted.
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20. A. Usuki, US Pat. 4889885, 26 December 1989.