DataVXJournal of Materials SciencePaper
journal article·2025-05

Review: Recent advancements of etched aluminum foil for aluminum electrolytic capacitors

Tian Zhu, Guizhong Feng, Lu Ning, Ning Peng

Journal of Materials Science· Volume 60· Issue 17
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Abstract

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Energy storage

OpenAlex topics: Anodic Oxide Films and Nanostructures · Semiconductor materials and devices · Supercapacitor Materials and Fabrication

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References (100+)

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1. Osawa N, Fukuoka K (2000) Pit nucleation behavior of aluminium foil for electrolytic capacitors during early stage of DC etching. Corros Sci 42:585–597. https://doi.org/10.1016/S0010-938X(99)00117-110.1016/S0010-938X(99)00117-1 ↗
2. Anawati B, Graver H, Nordmark Z, Zhao GS, Frankel JC, Walmsley K (2010) Nisancioglu, multilayer corrosion of aluminum activated by lead. J Electrochem Soc 157(10):313–321. https://doi.org/10.1149/1.347866310.1149/1.3478663 ↗
3. Kudoh Y, Nishino A (2001) Recent development in electrolytic capacitors and electric double layer capacitors. Electrochemistry 69(6):397–406. https://doi.org/10.5796/electrochemistry.69.39710.5796/electrochemistry.69.397 ↗
4. Pyun SI, Lee WJ (2001) The effect of prior Cl- ion incorporation into native oxide film on pure aluminium in neutral chloride solution on pit initiation. Corros Sci 43(2):353–363. https://doi.org/10.1016/S0010-938X(00)00077-910.1016/S0010-938X(00)00077-9 ↗
5. Sehgal A (1998) Pitting in aluminum thin films. J Electrochem Soc 145(8):2834. https://doi.org/10.1149/1.183872210.1149/1.1838722 ↗
6. Li X, Lin BG, Xiong LL, Du XF (2020) Symmetric pulsed anodizing of aluminum foil for aluminum electrolytic capacitors. Acs Appl Energy Mater 3(2):1804–1810. https://doi.org/10.1021/acsaem.9b0224610.1021/acsaem.9b02246 ↗
7. Martin FJ, Cheek GT, O’Grady WE, Natishan PM (2005) Impedance studies of the passive film on aluminium. Corros Sci 47(12):3187–3201. https://doi.org/10.1016/j.corsci.2005.05.05810.1016/j.corsci.2005.05.058 ↗
8. Peng N, Liang LB, He YD, Song HZ, Yang XF, Cai XY (2014) Effect of tunnel structure on the specific capacitance of etched aluminum foil. Int J Miner Metall Mater 21(10):974–979. https://doi.org/10.1007/s12613-014-0998-210.1007/s12613-014-0998-2 ↗
9. Ban C, He Y, Shao X, Wang L (2014) Anodizing of etched aluminum foil coated with modified hydrous oxide film for aluminum electrolytic capacitor. J Mater Sci: Mater Electron 25(1):128–133. https://doi.org/10.1007/s10854-013-1561-z10.1007/s10854-013-1561-z ↗
10. Ispas A, Bund A, Vrublevsky I (2010) Effects of a magnetic field on growth of porous alumina films on aluminum. Electrochim Acta 55:4180–4187. https://doi.org/10.1016/j.electacta.2010.02.06610.1016/j.electacta.2010.02.066 ↗
11. Dunn CG, Bolon RB (1969) Technique for a scanning electron microscope study of etched aluminum. J Electrochem Soc 116(7):1050–1052. https://doi.org/10.1149/1.241215610.1149/1.2412156 ↗
12. Nishio K, Yanagishita T, Yoshida M, Hayakawa T, Masuda H (2015) Enlargement of surface area of Al by electrochemical insertion and deinsertion of Li. Electrochem Commun 59:13–15. https://doi.org/10.1016/j.elecom.2015.06.01710.1016/j.elecom.2015.06.017 ↗
13. Alwitt RS, Uchi H (1984) Electrochemical tunnel etching of aluminum. J Electrochem Soc 131(1):13–17. https://doi.org/10.1149/1.211549510.1149/1.2115495 ↗
14. Yoo JE, Choi JC (2011) Electrochemical surface enlargement of a niobium foil for electrolytic capacitor applications. Electrochem Commun 13:298–301. https://doi.org/10.1016/j.elecom.2011.01.00910.1016/j.elecom.2011.01.009 ↗
15. Li Y, Peng N, Shang W, Wen Y, He Y (2020) Optimization of initiation sites of tunnel pits on aluminum foil using self-ordered concave structures. J Electrochem Soc 167(2):021508. https://doi.org/10.1149/1945-7111/ab6b0e10.1149/1945-7111/ab6b0e ↗
16. Soltis J (2015) Passivity breakdown, pit initiation and propagation of pits in metallic materials-Review. Corros Sci 90:5–22. https://doi.org/10.1016/j.corsci.2014.10.00610.1016/j.corsci.2014.10.006 ↗
17. Ban C, He Y, Shao X (2013) Effects of polymer corrosion inhibitor on widening etch tunnels of aluminum foil for capacitor. Corros Sci 78:7–12. https://doi.org/10.1016/j.corsci.2013.07.01110.1016/j.corsci.2013.07.011 ↗
18. Ban CL, Chen JH, Wang FR, Zhu SQ, Liu ZQ (2019) Etching anode foil with branch tunnels for aluminum electrolytic capacitors. J Nanosci Nanotechnol 19(11):7471–7475. https://doi.org/10.1166/jnn.2019.1672110.1166/jnn.2019.16721 ↗
19. Ning Peng YH, Yang Hong (2018) Effects of H2SO4 content on electrochemical activation of etched tunnels on aluminum foil. Corrosion. https://doi.org/10.5006/226910.5006/2269 ↗
20. Peng N, Liang L, Wen Y (2020) Effects of silicone oil additives on hydrogen adsorption and tunnel formation of aluminium foil. Corros Sci. https://doi.org/10.1016/j.corsci.2020.10903910.1016/j.corsci.2020.109039 ↗
21. Kneynsberg H, Verbraak C, ten Bouwhuijs M (1985) The influence of inhomogeneous rolling on the capacity of aluminium anode foil material. Mater Sci Eng 72(2):171–176. https://doi.org/10.1016/0025-5416(85)90156-910.1016/0025-5416(85)90156-9 ↗
22. Lee WJ, Pyun SI (2000) Role of prior cathodic polarization in the pitting corrosion of pure aluminium in acidic chloride solution. Mater Sci Eng, A 279(1):130–137. https://doi.org/10.1016/S0921-5093(99)00638-310.1016/S0921-5093(99)00638-3 ↗
23. Nagayama M, Tamura K (1967) Dissolution of the anodic oxide film on aluminium in a sulphuric acid solution. Electrochim Acta 12(8):1097–1107. https://doi.org/10.1016/0013-4686(67)80105-110.1016/0013-4686(67)80105-1 ↗
24. Baumgartner M, Kaesche H (1990) Aluminum pitting in chloride solutions: morphology and pit growth kinetics. Corros Sci 31:231–236. https://doi.org/10.1016/0010-938x(90)90112-i10.1016/0010-938x(90)90112-i ↗
25. Thompson G, Wood G (1978) The effect of alternating voltage on aluminium electrodes in hydrochloric acid. Corros Sci 18(8):721–746. https://doi.org/10.1016/S0010-938X(78)80092-410.1016/S0010-938X(78)80092-4 ↗
26. Dorsey GA (1969) Some evidence for duplex film structuring within the anodic alumina barrier layer. J Electrochem Soc 116(4):466. https://doi.org/10.1149/1.241190510.1149/1.2411905 ↗
27. Lee J, Kim J, Kim J, Lee J, Chung H, Tak Y (2009) Effects of pretreatment on the aluminium etch pit formation. Corros Sci 51(7):1501–1505. https://doi.org/10.1016/j.corsci.2009.02.02810.1016/j.corsci.2009.02.028 ↗
28. Adhikari S, Lee J, Hebert KR (2008) Formation of aluminum hydride during alkaline dissolution of aluminum. J Electrochem Soc 155(1):16–21. https://doi.org/10.1149/1.280077010.1149/1.2800770 ↗
29. Adhikari S, Hebert KR (2008) Participation of aluminum hydride in the anodic dissolution of aluminum in alkaline solutions. J Electrochem Soc 155(5):189–195. https://doi.org/10.1149/1.288382710.1149/1.2883827 ↗
30. Geiculescu AC, Strange TF (2003) Characterization of crystalline alumina films formed in alcohol–water solutions. Thin Solid Films 445(1):105–111. https://doi.org/10.1016/s0040-6090(03)01194-510.1016/s0040-6090(03)01194-5 ↗
31. Alwitt RS (1974) The growth of hydrous oxide films on aluminum. J Electrochem Soc 121(10):1322–1328. https://doi.org/10.1149/1.240167910.1149/1.2401679 ↗
32. Zhang XM, Liu JC, Tang JG, Li L, Chen MA, Liu SD, Zhu B (2010) Element segregation on the surfaces of pure aluminum foils. Appl Surf Sci 256:7300–7304. https://doi.org/10.1016/j.apsusc.2010.05.06710.1016/j.apsusc.2010.05.067 ↗
33. Dong H, Sun K, Li X, Li H, You P, Chen S, Zhou J (2024) Effects of organic acid and phosphoric acid at the low-voltage stage of the high-voltage forming process for the anode dielectric film of an aluminum electrolytic capacitor. Int J Electrochem Sci. https://doi.org/10.1016/j.ijoes.2024.10058710.1016/j.ijoes.2024.100587 ↗
34. Sato F, Sakurai T, Hoshino K (1999) Passivity of 4N pure aluminum sheet for electrolytic capacitor electrodes. Appl Surf Sci 140(1):111–117. https://doi.org/10.1016/S0169-4332(98)00571-610.1016/S0169-4332(98)00571-6 ↗
35. Li Y, An J, Zhao J, Hou W, Liu S, Xu Y (2023) Anodizing model and CV simulation for etched aluminium foil for high voltage. Electrochim Acta. https://doi.org/10.1016/j.electacta.2023.14296910.1016/j.electacta.2023.142969 ↗
36. Li X, Du X, Xiong L (2023) Alkali assisted water treatment of aluminum promoting the growth of hydrated oxide film for energy conservation. Surfaces Interf. https://doi.org/10.1016/j.surfin.2023.10303910.1016/j.surfin.2023.103039 ↗
37. Kawahara K, Kikuchi T, Natsui S, Suzuki RO (2018) Fabrication of ordered submicrometer-scale convex lens array via nanoimprint lithography using an anodized aluminum mold. Microelectron Eng 185–186:61–68. https://doi.org/10.1016/j.mee.2017.10.01610.1016/j.mee.2017.10.016 ↗
38. Lin CF, Hebert KR (1990) The effect of prior cathodic polarization on the initiation of pitting on aluminum. J Electrochem Soc 137(12):3723–3730. https://doi.org/10.1016/j.corsci.2013.06.03410.1016/j.corsci.2013.06.034 ↗
39. Yao L, Liu J, Li S, Yu M (2014) Effects of prior cathodic polarization on crystallographic pit initiation on aluminum. Corros Sci 80:12–18. https://doi.org/10.1016/j.corsci.2013.06.03410.1016/j.corsci.2013.06.034 ↗
40. Tan J, Nisancioglu K (2013) Effect of small amounts of alloyed tin on the electrochemical behaviour of aluminium in sodium chloride solution. Corros Sci 76:219–230. https://doi.org/10.1016/j.corsci.2013.06.04510.1016/j.corsci.2013.06.045 ↗
41. El-Sherif RM, Ismail KM, Badawy WA (2004) Effect of Zn and Pb as alloying elements on the electrochemical behavior of brass in NaCl solutions. Electrochim Acta 49(28):5139–5150. https://doi.org/10.1016/j.electacta.2004.06.02710.1016/j.electacta.2004.06.027 ↗
42. Ban CL, Zhu SQ, Hou JL, Wang FR, Wang J (2017) Effect of electrodepositing Ag on DC etching aluminum foils for electrolytic capacitor. J Mater Sci: Mater Electron 28(9):6860–6864. https://doi.org/10.1007/s10854-017-6385-910.1007/s10854-017-6385-9 ↗
43. Wang H, Li W, Ren H, Huang L, Wang X (2010) Effect of cerium addition on microstructure and texture of aluminum foil for electrolytic capacitors. J Rare Earths 28(1):134–137. https://doi.org/10.1016/s1002-0721(09)60066-110.1016/s1002-0721(09)60066-1 ↗
44. Anawati H, Nordmark S, Diplas JC, Walmsley K (2012) Nisancioglu, surface segregation of trace element bismuth during heat treatment of aluminum. J Electrochem Soc 159(3):137–145. https://doi.org/10.1149/2.100203jes10.1149/2.100203jes ↗
45. Wei H, Huang H, Peng N, Yao H (2020) Effect of electroless pretreatment on the distribution of etched tunnels on aluminum foil. Int J Electrochem Sci. 15(9):8452–845810.20964/2020.09.66 ↗
46. Zhang JP, Jerrold JE, Carroll DL (2010) Controllable fabrication of porous alumina templates for nanostructures synthesis. Mater Chem Phys 122:295–300. https://doi.org/10.1016/j.matchemphys.2010.02.02310.1016/j.matchemphys.2010.02.023 ↗
47. Goad DGW, Uchi H (2000) Modelling the capacitance of d.c. etched aluminumium electrolytic capacitor foil. J. Appl. Electrochem. 30(6):285–29110.1023/A:1003527316173 ↗
48. Goad D (1997) Tunnel morphology in anodic etching of aluminum. J Electrochem Soc 144(6):1965. https://doi.org/10.1149/1.183773010.1149/1.1837730 ↗
49. Lin W, Tu GC, Lin CF, Peng YM (1996) The effect of Lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage. Corros Sci 38(6):889–90710.1016/0010-938X(96)00175-8 ↗
50. Lin W, Tu GC, Lin CF, Peng YM (1997) The effect of Indium impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage. Corros Sci 39(9):1531–1543. https://doi.org/10.1016/S0010-938X(97)00052-810.1016/S0010-938X(97)00052-8 ↗
51. Peng N, Xu G, Wang P, Li J, Yang X (2021) Improving the specific surface area of etched aluminum foil by fabricating the Micro/Nano structure. ECS J Solid State Sci Technol 10(12):124005. https://doi.org/10.1149/2162-8777/ac438710.1149/2162-8777/ac4387 ↗
52. Ban CL, He YD, Shao X, Du J, Wang LP (2013) Effect of chemical plating Zn on DC-etching behavior of Al foil in HCl-H2SO4. Trans Nonfer Metals Soc China 23(12):3650–3657. https://doi.org/10.1016/s1003-6326(13)62913-110.1016/s1003-6326(13)62913-1 ↗
53. Peng N, He Y, Song H, Yang X, Cai X (2015) Effects of electrodeposited Zn nuclei on tunnel etching behavior of aluminum foil. Corrosion Sci. https://doi.org/10.1016/j.corsci.2014.11.02310.1016/j.corsci.2014.11.023 ↗
54. Liu F, Zhu K, Cheng J (2020) Formation and mechanistic analysis of self-etched tunnels on the surface of aluminum foil by the electrodeposition of trace Cu to form an electrolytic capacitor. J Mater Sci-Mater Electr 31(9):6937–6947. https://doi.org/10.1007/s10854-020-03257-210.1007/s10854-020-03257-2 ↗
55. Xu G, Peng N, Wang P, Xiao Y (2022) Effect of bipolar electrochemical process on tunnel etching characteristics of aluminum foil. J Electrochem Soc 169(3):033502. https://doi.org/10.1149/1945-7111/ac4e5410.1149/1945-7111/ac4e54 ↗
56. Nishio K, Fukushima T, Masuda H (2006) Control of pitting sites on Al for electrolytic capacitors using patterned masking film. Electrochem Solid-State Lett 9(9):B39. https://doi.org/10.1149/1.221436410.1149/1.2214364 ↗
57. Fukushima T, Nishio K, Masuda H (2010) Optimization of etching conditions for site-controlled tunnel pits with high aspect ratios in Al foil. J Electrochem Soc 157(4):137–139. https://doi.org/10.1149/1.330859410.1149/1.3308594 ↗
58. Masuda H, Tajima M, Nishio K (2002) Site control of tunnel etching of Al for electrolytic capacitors using pretexturing by mold. Chem Lett 11:1150–1151. https://doi.org/10.1246/cl.2002.115010.1246/cl.2002.1150 ↗
59. Asoh H, Nishio K, Nakao M, Tamamura T, Masuda H (2001) Conditions for fabrication of ideally ordered anodic porous alumina using pretextured Al. J Electrochem Soc 148(4):B152. https://doi.org/10.1149/1.135568610.1149/1.1355686 ↗
60. Nishio K, Kanezawa K, Masuda H (2006) Control of anisotropic tunnel etching of Al by indentation. Chem Lett 35(10):1096–1097. https://doi.org/10.1246/cl.2006.109610.1246/cl.2006.1096 ↗
61. Park HS, Lee CH, Cho HJ, Kim TY, Suh SJ (2012) Formation of uniform square-shaped tunnel pit by electrochemical etching with an opened polyimide layer on aluminum foil. Surf Interface Anal 44(11–12):1423–1426. https://doi.org/10.1002/sia.496110.1002/sia.4961 ↗
62. Jang JH, Choi WS, Kim NJ, Lee CH, Kim TY, Park C, Suh SJ (2010) Formation of aluminum tunnel pits arrayed using SU-8 masks with UV-assisted thermal imprint lithography. Microelectron Eng 87(12):2610–2613. https://doi.org/10.1016/j.mee.2010.07.02510.1016/j.mee.2010.07.025 ↗
63. Fukushima T, Takeda A, Nishio K, Masuda H (2010) Fabrication of ordered trench structures with high aspect ratios by anisotropic anode etching of Al (100). Electrochem Solid-State Lett 13(7):17–19. https://doi.org/10.1149/1.338851110.1149/1.3388511 ↗
64. Fukushima T, Nishio K, Masuda H (2010) Inkjet printing for site-controlled tunnel pitting with high aspect ratio in Al. Electrochem Solid-State Lett 13(4):C9–C11. https://doi.org/10.1149/1.329451910.1149/1.3294519 ↗
65. Asoh H, Nakamura K, Ono S (2007) Control of pit initiation sites on aluminum foil using colloidal crystals as mask. Electrochim Acta 53(1):83–86. https://doi.org/10.1016/j.electacta.2007.01.02110.1016/j.electacta.2007.01.021 ↗
66. Ono S, Uchibori K, Asoh H (2010) Control of nano/microstructure and pit initiation sites on aluminium surface by use of self-assembled spheres. Surf Interface Anal 42(4):264–268. https://doi.org/10.1002/sia.320110.1002/sia.3201 ↗
67. Liang L, He Y, Song H, Yang X, Cai X, Xiong C, Li Y (2013) Effect of hydration pretreatment on tunnel etching behaviour of aluminium foil. Corros Sci 70(6):180–187. https://doi.org/10.1016/j.corsci.2013.01.02710.1016/j.corsci.2013.01.027 ↗
68. Liang L, Pan S, Peng N (2021) Distribution improvement of etch tunnels on aluminum foil coated by Al2O3 film doped with ZnO microspheres. Surf Coat Technol. https://doi.org/10.1016/j.surfcoat.2021.12743910.1016/j.surfcoat.2021.127439 ↗
69. Peng N, Li Y, Li J, Yang X (2021) Synergistic effect of rapid anodization and hydration on the distribution of the etched tunnels for aluminum foil. J Electrochem Soc 168(9):091502. https://doi.org/10.1149/1945-7111/ac27dd10.1149/1945-7111/ac27dd ↗
70. Tak Y (1994) Initial Events during the passivation of rapidly dissolving aluminum surfaces. J Electrochem Soc 141(6):1453. https://doi.org/10.1149/1.205494510.1149/1.2054945 ↗
71. Xiao RG, Yan KP, Yan JX, Wang JZ (2008) Electrochemical etching model in aluminum foil for capacitor. Corros Sci 50(6):1576–1583. https://doi.org/10.1016/j.corsci.2008.02.01710.1016/j.corsci.2008.02.017 ↗
72. Ryu JH, Seo JH, Jeong JH, Kim SK, Lee DN (2004) The effect of aluminum ions on the DC etching of aluminum foil. J Appl Electrochem 34(8):879–884. https://doi.org/10.1023/B:JACH.0000040439.04947.f410.1023/B:JACH.0000040439.04947.f4 ↗
73. Deng B, Jiang YM, Liao JX, Hao YW, Zhong C, Li J (2007) Dependence of critical pitting temperature on the concentration of sulphate ion in chloride-containing solutions. Appl Surf Sci 253(18):7369–7375. https://doi.org/10.1016/j.apsusc.2007.03.03410.1016/j.apsusc.2007.03.034 ↗
74. McCafferty E (2003) Sequence of steps in the pitting of aluminum by chloride ions. Corros Sci 45(7):1421–1438. https://doi.org/10.1016/s0010-938x(02)00231-710.1016/s0010-938x(02)00231-7 ↗
75. Flis J, Kowalczyk L (1995) Effect of sulphate anions on tunnel etching of aluminium. J Appl Electrochem 25(4):501–507
76. Ono S, Habazaki H (2009) Effect of sulfuric acid on pit propagation behaviour of aluminium under AC etch process. Corros Sci 51(10):2364–2370. https://doi.org/10.1016/j.corsci.2009.06.02110.1016/j.corsci.2009.06.021 ↗
77. Ono S, Habazaki H (2011) Pit growth behaviour of aluminium under galvanostatic control. Corros Sci 53(11):3521–3525. https://doi.org/10.1016/j.corsci.2011.06.02410.1016/j.corsci.2011.06.024 ↗
78. Kolics A, Polkinghorne JC, Wieckowski A (1998) Adsorption of sulfate and chloride ions on aluminum. Electrochim Acta 43:2605–2618. https://doi.org/10.1016/S0013-4686(97)10188-810.1016/S0013-4686(97)10188-8 ↗
79. Pyun SI, Moon SM, Ahn SH, S.S. KIM. (1999) Effects of Cl-, NO3- and SO4- ions on anodic dissolution of pure aluminum in alkaline solution. Corros. Sci. 41(8):653–66710.1016/S0010-938X(98)00132-2 ↗
80. Lin CS, Li WJ (2006) Pitting behavior of aluminum foil during alternating current etching in hydrochloric acid containing sulfate ions. J Electrochem Soc 153(1):51–56. https://doi.org/10.1149/1.213183010.1149/1.2131830 ↗
81. Hibino A, Tamaki M, Watanabe Y, Oki T (1992) The effect of sulfuric acid on tunnel etching of aluminum in hydrochloric acid. Japan Institute of Light Metals 42(7):440–44010.2464/jilm.42.440 ↗
82. Woo-Jin L, Su-Il P (2000) Effects of sulphate ion additives on the pitting corrosion of pure aluminum in 001 M NaCl solutiou. Electrochim Acta. https://doi.org/10.1016/S0013-4686(99)00418-110.1016/S0013-4686(99)00418-1 ↗
83. Lee WJ, Pyun SI (1999) Effects of hydroxide ion addition on anodic dissolution of pure aluminum in chloride ion-containing solution. Electrochim Acta 44:4041–4049. https://doi.org/10.1016/S0013-4686(99)00164-410.1016/S0013-4686(99)00164-4 ↗
84. Hung C, Lung O, Lien L (2007) Effect of acid concentration and current density on DC etching of aluminum electrolytic capacitor foil. Korean J Chem Eng 24(5):881–887. https://doi.org/10.1007/s11814-007-0059-x10.1007/s11814-007-0059-x ↗
85. Abd El Aal EE, Abd El Wanees S, Farouk A, Abd El Haleem SM (2013) Factors affecting the corrosion behaviour of aluminium in acid solutions II Inorganic additives as corrosion inhibitors for Al in HCl solutions. Corros Sci. 68:14–2410.1016/j.corsci.2012.09.038 ↗
86. Na K-H, Pyun S-I (2006) Effect of sulphate and molybdate ions on pitting corrosion of aluminium by using electrochemical noise analysis. J Electroanal Chem 596(1):7–12. https://doi.org/10.1016/j.jelechem.2006.06.01710.1016/j.jelechem.2006.06.017 ↗
87. Na K-H, Pyun S-I (2007) Effects of sulphate, nitrate and phosphate on pit initiation of pure aluminium in HCl-based solution. Corros Sci 49(6):2663–2675. https://doi.org/10.1016/j.corsci.2006.12.01210.1016/j.corsci.2006.12.012 ↗
88. Ui K, Yamasaki T, Koura N, Idemoto Y, Makino T, Furukawa M, Uchi H (2006) Growth model of reversed taper during early stage of DC etching on aluminum oriented to (100). Electrochemistry 74(9):737–743. https://doi.org/10.5796/electrochemistry.74.73710.5796/electrochemistry.74.737 ↗
89. Oh HJ, Lee JH, Ahn H-J, Jeong Y, Park N-J, Kim S-S, Chi C-S (2007) Etching characteristics of high-purity aluminum in hydrochloric acid solutions. Mater Sci Eng A. https://doi.org/10.1016/j.msea.2006.01.15910.1016/j.msea.2006.01.159 ↗
90. Fan Z, Zhu C, Chang F (2018) Effect of thiourea on the corrosion behavior of aluminum anode foil of aluminum electrolytic capacitor. J Mater Eng Perform 27(8):4168–4175. https://doi.org/10.1007/s11665-018-3530-410.1007/s11665-018-3530-4 ↗
91. Xiao YL, He FR, Zhang X, Xiang YG, Yu K, Luo XJ, Lyu GP (2019) Effect of additive DCTA on electrochemical tunnel etching of aluminum foil. Russ J Electrochem 55(12):1277–1283. https://doi.org/10.1134/s102319351909013110.1134/s1023193519090131 ↗
92. Pan SN, Liang LB, Lu BL, Li HB (2020) Microstructure evolution for oxide film of anodic aluminum foil used in high voltage electrolytic capacitor. J Alloy Compd 823:153795. https://doi.org/10.1016/j.jallcom.2020.15379510.1016/j.jallcom.2020.153795 ↗
93. Peng N, Wen YQ, He YD (2019) Improved distribution of etched tunnels on aluminum foil with silane treatment. Prog Org Coat 127:6. https://doi.org/10.1016/j.porgcoat.2018.11.01710.1016/j.porgcoat.2018.11.017 ↗
94. Luo X, Dong C, Xi Y, Ren C, Wu J, Zhang D, Yan X, Xu Y, Liu P, He Y, Li X (2021) Computational simulation and efficient evaluation on corrosion inhibitors for electrochemical etching on aluminum foil. Corros Sci. https://doi.org/10.1016/j.corsci.2021.10949210.1016/j.corsci.2021.109492 ↗
95. Luo X, Ren C, Wu J, Zhang D, Xi Y, Yan X, Xu Y, Liu P, Li X, Dong C (2022) Experimental and computational insights into self-assembly sodium oleate on anodized aluminum interface in electric field. Corros Sci. https://doi.org/10.1016/j.corsci.2022.11033410.1016/j.corsci.2022.110334 ↗
96. Bao H, Lian Y, Qiao Z, Zhang S, Meng X, Ma K, Zhu D, Zhao J, Zhang H (2024) N-doped carbon quantum dots as corrosion inhibitor for ultra-high voltage etched Al foil. Surf Coat Technol. https://doi.org/10.1016/j.surfcoat.2023.13024010.1016/j.surfcoat.2023.130240 ↗
97. Zhu C, Liu T, Qian F, Chen W, Chandrasekaran S, Yao B, Song Y, Duoss EB, Kuntz JD, Spadaccini CM, Worsley MA, Li Y (2017) 3D printed functional nanomaterials for electrochemical energy storage. Nano Today 15:107–120. https://doi.org/10.1016/j.nantod.2017.06.00710.1016/j.nantod.2017.06.007 ↗
98. Kang J, Shin Y, Tak Y (2005) Growth of etch pits formed during sonoelectrochemical etching of aluminum. Electrochim Acta 51(5):1012–1016. https://doi.org/10.1016/j.electacta.2005.04.07010.1016/j.electacta.2005.04.070 ↗
99. Lin CC, Chang CC (2011) Effect of conditions of ultrasonic and electrochemical etching on morphology and capacitance of etched aluminum electrodes. Electrochemistry 79(7):553–557. https://doi.org/10.5796/electrochemistry.79.55310.5796/electrochemistry.79.553 ↗
100. Hu B, Sun Y, Guan B, Zhao J, Zhang H, Zhu D, Ma K, Cheng C (2017) Ultrasonic effect on etching tunnel morphology and distribution of aluminum foil. Appl Surf Sci 392:375–383. https://doi.org/10.1016/j.apsusc.2016.09.07410.1016/j.apsusc.2016.09.074 ↗