journal article·2020-08

Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy

Duy Le Han, Yu-An Shen, Sanghun Jin, Hiroshi Nishikawa

Journal of Materials Science· Volume 55· Issue 24
Publisher page

Abstract

Alloys with melting points < 150 °C are required for the development of flexible consumer devices. While the eutectic In–48Sn alloy is a promising candidate for these applications, its low tensile strength and low creep resistance during solid-state aging are of concern. The addition of Ag can address this issue to some extent; however, the effect of added Ag on the properties of the alloy is not well understood. Here, we studied the effects of added xAg (x = 0.5, 1.0, 1.5 wt.%) on the fusion start temperature, microstructure, and mechanical properties of the In–Sn eutectic alloy and found that the fusion start temperature of the In–48Sn–xAg alloy was reduced to around 113 °C due to the ternary eutectic reaction of In–Sn–Ag, in which e-AgIn2 only formed in the In–48Sn–xAg alloys. In addition, smaller β-In3Sn and γ-InSn4 phases were produced through the formation of e-AgIn2, which affected the mechanical properties of the alloy. In–48Sn–1.5Ag, with the smallest grains, exhibited the highest tensile strength of 12.5 MPa via boundary strengthening. In–48Sn–1.5Ag fractured in transgranular mode, which is different from the intergranular fracturing of the eutectic alloy with relatively large grains. Conversely, In–48Sn–0.5Ag, with the highest soft-β-In3Sn/hard-γ-InSn4 ratio, showed the longest elongation of 64%, which is twice that of the eutectic In–48Sn alloy.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Integrated Circuits and Semiconductor Failure Analysis · High Temperature Alloys and Creep

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (25)

Show source-provided references
1. Kim TW, Yan M, Erlat AG et al (2005) Transparent hybrid inorganic/organic barrier coatings for plastic organic light-emitting diode substrates. J Vac Sci Technol A 23:971–977. https://doi.org/10.1116/1.191368010.1116/1.1913680 ↗
2. Liu YF, Feng J, Bi YG et al (2019) Recent developments in flexible organic light-emitting devices. Adv Mater Technol 4:1–19. https://doi.org/10.1002/admt.20180037110.1002/admt.201800371 ↗
3. Shen Y-A, Zhou S, Li J et al (2019) Sn–3.0Ag–0.5Cu/Sn–58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology. Mater Des 183:108144. https://doi.org/10.1016/j.matdes.2019.10814410.1016/j.matdes.2019.108144 ↗
4. Shen YA, Zhou S, Li J et al (2019) Thermomigration induced microstructure and property changes in Sn–58Bi solders. Mater Des. https://doi.org/10.1016/j.matdes.2019.10761910.1016/j.matdes.2019.107619 ↗
5. Zhou S, Shen YA, Uresti T et al (2019) Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy. J Mater Sci: Mater Electron 30:7423–7434. https://doi.org/10.1007/s10854-019-01056-y10.1007/s10854-019-01056-y ↗
6. Gleason J, Schroeder V, Henshall G et al (2008) Design, materials, and assembly process of high-density packages with a low: temperature lead-free solder (SnBiAg). Solder Surf Mt Technol 20(2):11–20. https://doi.org/10.1108/0954091081087152010.1108/09540910810871520 ↗
7. Mei Z, Morris JW (1992) Characterization of eutectic Sn–Bi solder joints. J Electron Mater 21:599–607. https://doi.org/10.1007/BF0265542710.1007/BF02655427 ↗
8. Zhou S, Mokhtari O, Rafique MG et al (2018) Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt.% Zn addition before and after thermal aging. J Alloys Compd 765:1243–1252. https://doi.org/10.1016/j.jallcom.2018.06.12110.1016/j.jallcom.2018.06.121 ↗
9. Wang F, Chen H, Huang Y et al (2019) Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. J Mater Sci: Mater Electron 30:3222–324310.1007/BF01209241 ↗
10. Macdonald WA (2007) Latest advances in substrates for flexible electronics. J Soc Inf Disp 15:1075–1083. https://doi.org/10.1889/1.282509310.1889/1.2825093 ↗
11. Chuang TH, Yu CL, Chang SY, Wang SS (2002) Phase identification and growth kinetics of the intermetallic compounds formed during In–49Sn/Cu soldering reactions. J Electron Mater 31:640–645. https://doi.org/10.1007/s11664-002-0136-110.1007/s11664-002-0136-1 ↗
12. Abtew M, Selvaduray G (2000) Lead-free solders in microelectronics. Mater Sci Eng R Rep 27:95–141. https://doi.org/10.1016/S0927-796X(00)00010-310.1016/S0927-796X(00)00010-3 ↗
13. Kim SH, Yang S (2017) Low melting temperature solder materials for use in flexible microelectronic packaging applications. In: Recent progress in soldering materials. Intech, pp 8–37
14. Goldstein JLF, Morris JW (1994) The effect of substrate on microstructure and creep of eutectic In–Sn. Metall Mater Trans Trans A 323:2715–2722. https://doi.org/10.1557/PROC-323-15910.1557/PROC-323-159 ↗
15. Glazer J (1995) Metallurgy of low temperature Pb-free solders for electronic assembly. Int Mater Rev 40:65–93. https://doi.org/10.1179/imr.1995.40.2.6510.1179/imr.1995.40.2.65 ↗
16. Wang J, Mao D, Shi L et al (2019) Effect of zinc addition on the microstructure, thermal and mechanical properties of indium-Tin-xZinc alloys. J Electron Mater 48:817–826. https://doi.org/10.1007/s11664-018-6768-610.1007/s11664-018-6768-6 ↗
17. Kim SH, Yeon S-M, Kim JH et al (2019) Fine microstructured In–Sn–Bi solder for adhesion on a flexible PET substrate: its effect on superplasticity and toughness. ACS Appl Mater Interfaces. https://doi.org/10.1021/acsami.9b0415910.1021/acsami.9b04159 ↗
18. El-Bediwi AB, El-Bahay MM (2004) Influence of silver on structural, electrical, mechanical and soldering properties of tin-indium based alloys. Radiat Eff Defects Solids 159:133–140. https://doi.org/10.1080/1042015041000167028810.1080/10420150410001670288 ↗
19. Jones WK, Liu Y, Shah M, Clarke R (1997) Mechanical properties of Pb/Sn Pb/In and Sn–In solders. Solder Surf Mt Technol, 37–41
20. Ohnuma I, Cui Y, Liu XJ et al (2000) Phase equilibria of Sn–In based micro-soldering alloys. J Electron Mater 29:1113–1121. https://doi.org/10.1007/s11664-000-0002-y10.1007/s11664-000-0002-y ↗
21. Korhonen TM, Kivilahti JK (1998) Thermodynamics of the Sn–In–Ag solder system. J Electron Mater 27:149–158. https://doi.org/10.1007/s11664-998-0205-110.1007/s11664-998-0205-1 ↗
22. Chuang TH, Huang YT, Tsao LC (2001) AgIn2/Ag2In transformations in an In–49Sn/Ag soldered joint under thermal aging. J Electron Mater 30:945–95010.1007/BF02657715 ↗
23. Callister WD Jr, Rethwisch DG (2015) Fundamentals materials science and engineering: an integrated approach, 5th edn. Wiley, London
24. Lu K, Lu L, Suresh S (2009) Strengthening materials by boundaries at the nanoscale. Science 80:349–353. https://doi.org/10.1126/science.115961010.1126/science.1159610 ↗
25. Askeland DR, Fulay PP (2009) Essentials of materials science and engineering, second. Cengage Learning, Toronto ON M1K 5G4 Canada