Regulating the orientation and distribution of nanotwins by trace of gelatin during direct current electroplating copper on titanium substrate
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Corrosion Behavior and Inhibition · Anodic Oxide Films and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (33)
Show source-provided references
1. Dela Pena EM, Roy S (2018) Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives. Surf Coat Technol 339:101–110. Doi: https://doi.org/10.1016/j.surfcoat.2018.01.067.10.1016/j.surfcoat.2018.01.067 ↗
2. LY Gao H Zhang CF Li J Guo ZQ Liu 2018 Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package J Mater Sci Technol 34 1305 1314 https://doi.org/10.1016/j.jmst.2017.11.04610.1016/j.jmst.2017.11.046 ↗
3. H Jeong CJ Lee JH Kim JY Son SB Jung 2020 Electromigration behavior of Cu core solder joints under high current density Electron Mater Lett 16 513 519 https://doi.org/10.1007/s13391-020-00239-810.1007/s13391-020-00239-8 ↗
4. K Son GT Park BR Lee CW Yang JS Han TK Lee YB Park 2020 Effect of electromigration-induced joule heating on the reliability of sn-ag microbump with different UBM structures J Electron Mater 49 7228 7237 https://doi.org/10.1007/s11664-020-08527-710.1007/s11664-020-08527-7 ↗
5. L Lu YF Shen XH Chen LH Qian K Lu 2004 Ultrahigh strength and high electrical conductivity in copper Science 304 422 426 https://doi.org/10.1126/science.109290510.1126/science.1092905 ↗
6. X Zhou XY Li K Lu 2018 Enhanced thermal stability of nanograined metals below a critical grain size Science 360 526 529 https://doi.org/10.1126/science.aar694110.1126/science.aar6941 ↗
7. L Lu X Chen X Huang K Lu 2009 Revealing the Maximum Strength in Nanotwinned Copper Science 323 607 610 https://doi.org/10.1126/science.116764110.1126/science.1167641 ↗
8. K-J Chen JA Wu C Chen 2020 Effect of reverse currents during electroplating on the < 111 >-oriented and nanotwinned columnar grain growth of copper films Cryst Growth Des 20 3834 3841 https://doi.org/10.1021/acs.cgd.0c0014210.1021/acs.cgd.0c00142 ↗
9. C-H Tseng C Chen 2019 Growth of highly (111)-oriented nanotwinned cu with the addition of sulfuric acid in CuSO4 based electrolyte Cryst Growth Des 19 81 89 https://doi.org/10.1021/acs.cgd.8b0091610.1021/acs.cgd.8b00916 ↗
10. L Chai K Chen Y Zhi KL Murty L-Y Chen Z Yang 2018 Nanotwins induced by pulsed laser and their hardening effect in a Zr alloy J Alloys Compd 748 163 170 https://doi.org/10.1016/j.jallcom.2018.03.12610.1016/j.jallcom.2018.03.126 ↗
11. S Zhao R Zhang Q Yu J Ell RO Ritchie AM Minor 2021 Cryoforged nanotwinned titanium with ultrahigh strength and ductility Science 373 1363 1368 https://doi.org/10.1126/science.abe725210.1126/science.abe7252 ↗
12. Duan F, Lin Y, Pan J, Zhao L, Guo Q, Zhang D, Li Y (2021) Ultrastrong nanotwinned pure nickel with extremely fine twin thickness. Sci Adv, 7. Doi: https://doi.org/10.1126/sciadv.abg5113.10.1126/sciadv.abg5113 ↗
13. HY Hsiao CM Liu HW Lin TC Liu CL Lu YS Huang C Chen KN Tu 2012 Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper Science 336 1007 1010 https://doi.org/10.1126/science.121651110.1126/science.1216511 ↗
14. TC Liu CM Liu YS Huang C Chen KN Tu 2013 Eliminate Kirkendall voids in solder reactions on nanotwinned copper Scr Mater 68 241 244 https://doi.org/10.1016/j.scriptamat.2012.10.02410.1016/j.scriptamat.2012.10.024 ↗
15. HW Lin CL Lu CM Liu C Chen D Chen JC Kuo KN Tu 2013 Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu Acta Mater 61 4910 4919 https://doi.org/10.1016/j.actamat.2013.04.05610.1016/j.actamat.2013.04.056 ↗
16. Huang J, Gao LY, Liu ZQ (2020) The electrochemical behavior of leveler JGB during electroplating of nanotwinned copper. In: 2020 21st international conference on electronic packaging technology (ICEPT), Guangzhou, China, pp 1–4. Doi:https://doi.org/10.1109/ICEPT50128.2020.9202497.10.1109/ICEPT50128.2020.9202497 ↗
17. Chiang P-C, Shen Y-A, Feng S-P, Chen C-M (2020) Electrodeposition of twinned Cu with strong texture effect on voiding propensity in electroplated Cu solder joints. J. Electrochem. Soc., 167.Doi: https://doi.org/10.1149/1945-7111/abd51710.1149/1945-7111/abd517 ↗
18. Bai Y, Hu H, Ling H, Hang T, Hu A, Wu Y, Li M (2021) Communication-fabrication of vertical nanotwinned copper with (220) texture by direct current electrodeposition. J Electrochem Soc 168. Doi: https://doi.org/10.1149/1945-7111/ac1b4c10.1149/1945-7111/ac1b4c ↗
19. M Hasegawa M Mieszala Y Zhang R Erni J Michler L Philippe 2015 Orientation-controlled nanotwinned copper prepared by electrodeposition Electrochim Acta 178 458 467 https://doi.org/10.1016/j.electacta.2015.08.02210.1016/j.electacta.2015.08.022 ↗
20. Xu D, Kwan WL, Chen K, Zhang X, Ozolins V, Tu KN (2007) Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition. Appl Phys Lett 91. Doi: https://doi.org/10.1063/1.282541210.1063/1.2825412 ↗
21. FL Sun LY Gao ZQ Liu H Zhang T Sugahara S Nagao K Suganuma 2018 Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate J Mater Sci Technol 34 1885 1890 https://doi.org/10.1016/j.jmst.2018.01.01610.1016/j.jmst.2018.01.016 ↗
22. Sun F-L, Liu Z-Q, Li C-F, Zhu Q-S, Zhang H, Suganuma K (2018) Bottom-up electrodeposition of large-scale nanotwinned copper within 3D through silicon via. Materials 11. Doi: https://doi.org/10.3390/ma1102031910.3390/ma11020319 ↗
23. Liu CM, Lin HW, Lu CL, Chen C (2014) Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu. Sci Rep, 4. Doi: https://doi.org/10.1038/srep0612310.1038/srep06123 ↗
24. Peng Z-J, Dong Y, Li Z, Fu X-Z, Liu Z-Q, Sun R (2022) Nanotwinned copper electroplating with halide engineered grain morphologies. In: 2022 23rd international conference on electronic packaging technology (ICEPT), Dalian, China, pp 1–510.1109/ICEPT56209.2022.9873345 ↗
25. LY Gao ZQ Liu L Liu J Wang ZX Zhou CQ Liu 2017 Diffusion barrier effect of Ni-W-P and Ni-Fe UBMs during high temperature storage IEEE 67th electronic components and technology conference (ECTC) Orlando, FL, USA 2017 1566 1571 https://doi.org/10.1109/ectc.2017.5110.1109/ectc.2017.51 ↗
26. LY Gao ZQ Liu CF Li 2017 Failure mechanisms of SAC/Fe-Ni solder joints during thermal cycling J Electron Mater 46 5338 5348 https://doi.org/10.1007/s11664-017-5554-110.1007/s11664-017-5554-1 ↗
27. Li ZG, Gao LY, Liu ZQ (2020) The effect of transition layer on the strength of nanotwinned copper film by DC electrodeposition. In: 2020 21st International conference on electronic packaging technology (ICEPT), Guangzhou, China, pp 1–3. Doi: https://doi.org/10.1109/ICEPT50128.2020.920291810.1109/ICEPT50128.2020.9202918 ↗
28. YH Zhao YZ Guo Q Wei AM Dangelewiez YT Zhu TG Langdon YZ Zhou EJ Lavernia C Xu 2008 Influence of specimen dimensions on the tensile behavior of ultrafine-grained Cu Scr Mater 59 627 630 https://doi.org/10.1016/j.scriptamat.2008.05.03110.1016/j.scriptamat.2008.05.031 ↗
29. Xu D, Sriram V, Ozolins V, Yang J-M, Tu KN, Stafford GR, Beauchamp C (2009) In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. J Appl Phys, 105. Doi: https://doi.org/10.1063/1.306819110.1063/1.3068191 ↗
30. FL Sun ZQ Liu CF Li QS Zhu H Zhang K Suganuma 2018 Bottom-up electrodeposition of large-scale nanotwinned copper within 3D through silicon via Materials 11 319 https://doi.org/10.3390/ma1102031910.3390/ma11020319 ↗
31. TC Liu CM Liu HY Hsiao JL Lu YS Huang C Chen 2012 Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition Cryst Growth Des 12 5012 5016 https://doi.org/10.1021/cg300962v10.1021/cg300962v ↗
32. Zhan X, Lian J, Li H, Wang X, Zhou J, Trieu K, Zhang X (2021) Preparation of highly (111) textured nanotwinned copper by me dium-frequency pulse d electrodeposition in an additive-free electrolyte. Electrochim Acta, 365. Doi: https://doi.org/10.1016/j.electacta.2020.13739110.1016/j.electacta.2020.137391 ↗
33. R Winand 1994 Electrodeposition of metals and alloys-New results and perspectives Electrochim Acta 39 1091 1105 https://doi.org/10.1016/0013-4686(94)e0023-s10.1016/0013-4686(94)e0023-s ↗