High-performance polyamide-imide films and electrospun aligned nanofibers from an amide-containing diamine
Source abstract
Abstract
Polyamide-imides (PAIs) are highly desired in many applications because of their superior thermal and mechanical properties. In this work, PAI was prepared from an amide-containing diamine and dianhydride by polycondensation and thermal treatment. Both PAI films and aligned electrospun nanofibers (ANFs) were fabricated. FT-IR was used to determine the structure formation of PAI at different annealing temperatures. DSC and TGA were used to evaluate the thermal properties of PAI, while tensile test was applied to evaluate the mechanical properties of PAI films and ANFs. The results indicated that the PAI possessed both outstanding thermal stability and mechanical properties, which provide opportunities for applications in gas separation, high temperature filtration, reinforcement, etc.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Synthesis and properties of polymers · Tribology and Wear Analysis · Fiber-reinforced polymer composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (54)
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