Performance Optimization of Sulfonium-Functionalized Molecular Resists for EUV and Electron Beam Lithography
Source abstract
Abstract
We report the synthesis and lithographic evaluation of a series of sulfonium-functionalized molecules nonchemically amplified resists (n-CARs) designed for high-resolution lithography. These molecular resists, built upon a rigid adamantane core, feature varied substitution positions (meta or para), side chains (methoxy or butoxy), and counteranions (CF 3 SO 3 –, BF 4 –, PF 6 –, and SbF 6 – ). Our study highlights that meta-substitution and the incorporation of flexible butoxy side chains significantly enhance the film quality and lithographic performance. Notably, the ADMBu-TF resist, functionalized with CF 3 SO 3 – and meta-substituted butoxy chains, exhibits the best lithographic performance. Using extreme ultraviolet lithography, we achieved 15 nm line/space (L/S) patterns with a line-edge roughness of 2.2 nm, positioning this resist as a promising candidate for next-generation lithographic processes.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advancements in Photolithography Techniques · Semiconductor materials and devices · Nanofabrication and Lithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Key Laboratory of Photochemical Conversion and Optoelectronic Materials, Technical Institute of Physics and Chemistry, University of Chinese Academy of Sciences
Chinese Academy of Sciences
Key Laboratory of Photochemistry, Institute of Chemistry, University of Chinese Academy of Sciences
Laboratory for X-ray Nanoscience and Technologies
Paul Scherrer Institute
Funding
National Natural Science Foundation of China · Chinese Academy of Sciences
References (57)
Show source-provided references
1. Turkot, B.; Carson, S. L.; Lio, A.; Liang, T.; Phillips, M.; McCool, B.; Stenehjem, E.; Crimmins, T.; Zhang, G.; Sivakumar, S. In EUV Progress toward HVM Readiness; Conference on Extreme Ultraviolet (EUV) Lithography VII, San Jose, CA, 2016 Feb 22–25; San Jose, CA, 2016.10.1117/12.2225014 ↗
2. 10.1016/b978-0-08-100354-1.00001-610.1016/b978-0-08-100354-1.00001-6 ↗
3. 10.1116/1.350135910.1116/1.3501359 ↗
4. 10.1016/j.mee.2014.07.01910.1016/j.mee.2014.07.019 ↗
5. 10.1039/D0TC04104A10.1039/D0TC04104A ↗
6. 10.7567/JJAP.57.05650110.7567/JJAP.57.056501 ↗
7. 10.1021/acs.chemmater.3c0262810.1021/acs.chemmater.3c02628 ↗
8. Yildirim, O.; Buitrago, E.; Hoefnagels, R.; Meeuwissen, M.; Wuister, S.; Rispens, S.; van Oosten, A.; Derks, P.; Finders, J.; Vockenhuber, M.; Ekinci, Y. In Improvements in resist performance towards EUV HVM, Conference on Extreme Ultraviolet (EUV) Lithography VIII, San Jose, CA, Feb 27-Mar 02; San Jose, CA, 2017.10.1117/12.2257415 ↗
9. 10.1016/j.mee.2014.06.01310.1016/j.mee.2014.06.013 ↗
10. 10.1039/C9TC06482F10.1039/C9TC06482F ↗
11. Blakey, I.; Yu, A.; Blinco, J.; Jack, K. S.; Liu, H.; Leeson, M.; Yeuh, W.; Younkin, T.; Whittaker, A. K. In Polycarbonate Based Non-chemically Amplified Photoresists for Extreme Ultraviolet Lithography. In Conference on Extreme Ultraviolet (EUV) Lithography: San Jose, CA, 2010. Feb 22–25; San Jose, CA, 2010.10.1117/12.853620 ↗
12. 10.1002/adfm.20200741710.1002/adfm.202007417 ↗
13. 10.1002/marc.20100011710.1002/marc.201000117 ↗
14. 10.1039/c0jm03288c10.1039/c0jm03288c ↗
15. 10.1016/j.radphyschem.2010.07.03810.1016/j.radphyschem.2010.07.038 ↗
16. 10.1021/acsami.4c0623010.1021/acsami.4c06230 ↗
17. 10.31635/ccschem.023.20230361610.31635/ccschem.023.202303616 ↗
18. 10.1016/j.mee.2014.04.02410.1016/j.mee.2014.04.024 ↗
19. 10.1002/smtd.20230030910.1002/smtd.202300309 ↗
20. 10.1007/s40843-024-3062-y10.1007/s40843-024-3062-y ↗
21. 10.1117/1.JMM.16.3.03351010.1117/1.JMM.16.3.033510 ↗
22. 10.3390/mi1509112210.3390/mi15091122 ↗
23. 10.1117/1.jmm.21.4.04140410.1117/1.jmm.21.4.041404 ↗
24. 10.1002/adfm.20220271010.1002/adfm.202202710 ↗
25. 10.1117/1.JMM.14.4.04350610.1117/1.JMM.14.4.043506 ↗
26. 10.1016/j.ccr.2023.21530710.1016/j.ccr.2023.215307 ↗
27. 10.1016/j.mattod.2023.05.02710.1016/j.mattod.2023.05.027 ↗
28. 10.2494/photopolymer.31.66910.2494/photopolymer.31.669 ↗
29. 10.1039/C7RA12934C10.1039/C7RA12934C ↗
30. 10.1016/j.apsusc.2020.14655310.1016/j.apsusc.2020.146553 ↗
31. 10.1021/acsaelm.0c0112010.1021/acsaelm.0c01120 ↗
32. 10.1021/acsapm.0c0000510.1021/acsapm.0c00005 ↗
33. 10.1038/srep2266410.1038/srep22664 ↗
34. 10.1039/c3tc31826e10.1039/c3tc31826e ↗
35. 10.1021/acsami.2c1994010.1021/acsami.2c19940 ↗
36. 10.1098/rsos.20213210.1098/rsos.202132 ↗
37. 10.1016/j.jphotochem.2022.11435110.1016/j.jphotochem.2022.114351 ↗
38. 10.1021/acsapm.8b0023510.1021/acsapm.8b00235 ↗
39. 10.1021/acsomega.2c0344510.1021/acsomega.2c03445 ↗
40. 10.1039/D2TC01339H10.1039/D2TC01339H ↗
41. 10.1007/s40242-022-2163-110.1007/s40242-022-2163-1 ↗
42. 10.1039/D3LF00254C10.1039/D3LF00254C ↗
43. 10.1021/acsanm.3c0390010.1021/acsanm.3c03900 ↗
44. 10.1117/1.jmm.23.3.03460110.1117/1.jmm.23.3.034601 ↗
45. 10.1021/ma00102a00210.1021/ma00102a002 ↗
46. 10.1117/1.jmm.21.4.04140310.1117/1.jmm.21.4.041403 ↗
47. 10.1021/jp811155610.1021/jp8111556 ↗
48. 10.1021/cm903893910.1021/cm9038939 ↗
49. 10.1002/app.2474910.1002/app.24749 ↗
50. 10.1002/cphc.20160141610.1002/cphc.201601416 ↗
51. 10.1002/admi.20230019410.1002/admi.202300194 ↗
52. 10.35848/1347-4065/abe7c210.35848/1347-4065/abe7c2 ↗
53. IEEE. International Roadmap for Devices and Systems 2023 Update: Lithography & Patterning 2023. https://irds.ieee.org/editions/2023 (accessed 09 28, 2023).
54. 10.1088/1361-6528/ad3c4c10.1088/1361-6528/ad3c4c ↗
55. Shinji, T.; Nobuaki, M.; Hidetoshi, O.; Naoyoshi, H.; Katsuki, I.; Kazuya, F.; Hiroaki, O.; Iwao, N. Adamantane-based molecular glass resist for 193-nm lithography and beyond. In Proc. SPIE, 2008, p 69231J.10.1117/12.772249 ↗
56. 10.1002/pol.2021087510.1002/pol.20210875 ↗
57. 10.1016/j.jphotochem.2018.06.00510.1016/j.jphotochem.2018.06.005 ↗