Preparation of high thermal conductivity diamond/copper composites by dynamic pressure infiltration
Source abstract
Abstract
ABSTRACT In this study, a novel dynamic pressure infiltration (DPI) technique has been proposed and applied for fabricating diamond/copper composites. Compared with composites prepared by conventional pressure infiltration (CPI), the DPI-prepared samples exhibit higher densification, more homogeneous diamond distribution and better interface bonding. The diamond/copper composite prepared by DPI achieved a maximum relative density of 98.55%, a high thermal conductivity of 872 W/(m·K), a low coefficient of thermal expansion of 5.06×10 -6 K -1 at 50 °C, and a flexural strength of 396 MPa. The result suggests that DPI processing is a more effective technique for the preparation of high-performance diamond/copper composites, which can be extended to the fabrication of other material systems.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Aluminum Alloys Composites Properties · Advanced ceramic materials synthesis · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (31)
Show source-provided references
1. Enhancing interfacial heat conduction in diamond-reinforced copper composites with boron carbide interlayers for thermal management10.1016/j.compositesb.2024.111871 ↗
2. Thermal conducting mechanisms in tungsten-coated diamond/copper composites10.1016/j.diamond.2025.113287 ↗
3. Study of the hot-pressing sintering process of diamond/copper composites and their thermal conductivity10.1016/j.jallcom.2023.170608 ↗
4. Metallurgical behaviors of tungsten coatings at diamond/Al interface and its influence on thermal conductivity and stability of diamond/Al composites10.1016/j.jallcom.2025.179539 ↗
5. Simultaneously enhancing heat transfer ability, thermal expansion matching and thermal stability of diamond-reinforced Cu matrix composites through multi-level interface layer design
6. Thermal properties of tungsten/tungsten carbide-coated double-size diamond/copper composite10.1016/j.diamond.2023.109818 ↗
7. Enhanced thermal conductivity and flexural properties in squeeze casted diamond/aluminum composites by processing control10.1016/j.matdes.2015.09.048 ↗
8. Achieving excellent thermal transport in diamond/Cu composites by breaking bonding strength-heat transfer trade-off dilemma at the interface10.1016/j.compositesb.2024.111925 ↗
9. Realizing ultrahigh thermal conductivity in bimodal-diamond/Al composites via interface engineering
10. Enhancing thermal conductivity of Diamond/Cu composites by regulating distribution of bimodal diamond particles10.1016/j.diamond.2019.107564 ↗
11. Fabrication and infiltration kinetics analysis of Ti-coated diamond/copper composites with near-net-shape by pressureless infiltration10.1016/j.mseb.2012.08.009 ↗
12. Preparation and thermal conductivity of tungsten coated diamond/copper composites10.1016/S1003-6326(22)65997-1 ↗
13. Synergetic effect enabling high thermal conductivity in Cu/diamond composite10.1016/j.diamond.2023.110213 ↗
14. High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites10.1016/j.scriptamat.2015.07.022 ↗
15. Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles10.1016/j.matchar.2014.07.025 ↗
16. Tailoring the thermal and mechanical properties of diamond/Cu composites by interface regulation of Cr alloying10.1016/j.diamond.2021.108309 ↗
17. Effect of oscillation frequency on microstructure and properties of WC-Co cemented carbide prepared by hot oscillating pressing10.1016/j.ijrmhm.2024.106922 ↗
18. Research progress on interfacial modification of diamond copper composites with high thermal conductivity
19. Highly conductive diamond skeleton reinforced Cu-matrix composites for high-efficiency thermal management10.1016/j.apsusc.2023.158829 ↗
20. High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration10.1016/j.jallcom.2017.11.273 ↗
21. Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration10.1016/j.ceramint.2019.02.156 ↗
22. Mechanical properties of a diamond–copper composite with high thermal conductivity10.1016/j.matdes.2015.08.048 ↗
23. Optimized thermal properties in diamond particles reinforced copper titanium matrix composites produced by gas pressure infiltration10.1016/j.compositesa.2016.10.005 ↗
24. Effect of diamond particle size on thermal conductivity and thermal stability of Zr-diamond/Cu composite10.1016/j.diamond.2024.111257 ↗
25. Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites10.1016/j.jallcom.2018.03.241 ↗
26. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X = Cr, B) diamond composites10.1016/j.scriptamat.2007.08.007 ↗
27. Thermal conductivity of Cu–Zr/diamond composites produced by high temperature–high pressure method10.1016/j.compositesb.2014.08.023 ↗
28. Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy10.1016/j.compscitech.2011.06.012 ↗
29. Interfacial thermal conductance between Cu and diamond with interconnected W−W2C interlayer10.1021/acsami.2c07190 ↗
30. High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix10.1007/s10853-010-4938-x ↗
31. Research progress of diamond/copper composites with high thermal conductivity10.1016/j.diamond.2020.107993 ↗