journal article·2026-07Open access

Electrochemical reaction process and mechanisms of Sn and Sn-58Bi solders in MSA, SSA, DEA, TEA, and TIPA flux solutions

P.Y. Guo, Q.H. Wu, X.J. Wang, M.X. Wei, Y. Shao, Z.G. Liu

Abstract

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OpenAlex topics: Electronic Packaging and Soldering Technologies · Molten salt chemistry and electrochemical processes · Metallurgical and Alloy Processes

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