Tensile strength modelling for nano-twinned Cu films with beneath fine Cu grains
Source abstract
Abstract
Equiaxed fine Cu-grains layer forms prior to nano-twinned Cu electroplated on Ti substrate. As nano-twinned Cu is forming, fine Cu-grains layer would grow at expense of its above nano-twinned Cu region by detwinning and refining nano-twinned Cu region. The conversion of nano-twinned Cu to fine Cu-grains is caused by the intrinsic stress build-up in nt-Cu films. A modified yield stress model for present nt-Cu films was proposed, which provides an unified physical and mathematical framework that captures the interplay between classical grain boundary strengthening, twin boundary strengthening, and the effect of the fine Cu-grains layer in nt-Cu films.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Microstructure and mechanical properties · Copper Interconnects and Reliability · Numerical methods in engineering
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (28)
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