Aging-dependent dual effect of indium addition on interfacial IMC growth and shear properties of Sn-0.7Cu-0.8Zn/Cu solder joints
Source abstract
Abstract
In the field of chip packaging, the excessive growth of interfacial intermetallic compounds (IMC) in solder joints during high-temperature aging has become a critical reliability concern. To investigate the effect of In addition on the high-temperature aging reliability of Sn-0.7Cu-0.8Zn/Cu solder joints, this study comparatively analyzed the IMC growth behavior and shear property evolution at the interface of Sn-0.7Cu-0.8Zn and Sn-0.7Cu-0.8Zn-3.5In solder joints during isothermal aging at 160 °C. The results indicate that In addition exhibits a dual effect on IMC growth: it suppresses IMC growth in the as-soldered condition, but promotes IMC growth after aging, increasing the growth rate coefficient from 0.09 μm/h 1/2 to 0.26 μm/h 1/2 . In atoms exist in solid solution within the IMC and β-Sn phases, generating a solution strengthening effect, while also leading to a more uniform distribution of IMC grains and a more stable Cu 6 Sn 5 phase. Shear performance tests reveal that the addition of In improves the shear strength of the solder joints by approximately 2 MPa at all aging times; however, the fracture mode transitions from ductile fracture in the solder matrix to mixed solder/IMC fracture. Considering both IMC growth behavior and shear property evolution, the addition of 3.5 wt.% In demonstrates a significant effect in enhancing the post-aging shear performance of Sn-0.7Cu-0.8Zn/Cu solder joints.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Nanomaterials and Printing Technologies · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (36)
Show source-provided references
1. New challenges of miniaturization of electronic devices: electromigration and thermomigration in lead-free solder joints10.1016/j.matdes.2020.108726 ↗
2. Improvement of PbSn solder reliability with Ge microalloying-induced optimization of intermetallic compounds growth10.3390/ma17030724 ↗
3. Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders10.1016/S1003-6326(22)65869-2 ↗
4. A study on cracks and IMCs in laser welding of Al and Cu
5. Crack initiation and propagation behavior of dissimilar interface with intermetallic compound layer in Al/steel joint using coupled multiscale mechanical testing10.1016/j.matdes.2023.112420 ↗
6. Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7 Cu solder alloy10.3390/ma16010096 ↗
7. Zn additions modifying microstructure, thermal parameters and cytotoxicity of Sn-0.7Cu eutectic solder alloys10.1016/j.matchar.2023.113337 ↗
8. Role of zinc on shear property evolution between Sn-0.7 Cu solder and joints10.1016/j.proeng.2011.08.1158 ↗
9. Improvement of Ga and Zn alloyed Sn-0.7Cu solder alloys and joints10.1007/s10854-015-2873-y ↗
10. The effects of the addition of CNT@ Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder10.1007/s10854-021-05742-8 ↗
11. Effect of in addition on the microstructure and mechanical properties of Sn-0.7Cu-0.8Zn/Cu solder joints10.1007/s11664-023-10371-4 ↗
12. Microstructure, IMCs layer and shear property of Sn-9Zn solder joints reinforced by Cu nanoparticles during thermal cycling10.1007/s10854-024-13958-7 ↗
13. Unexpected dual cracks in chip-ceramic substrate interconnect: unveiling the mechanism behind simultaneous cracking at both the top and bottom of a solder joint10.1016/j.engfailanal.2024.108942 ↗
14. Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: effect of annealing temperature10.1016/j.microrel.2019.113555 ↗
15. Growth behavior of Intermetallic layers in Sn-0.7Cu-xNi/Cu interfaces: a study on aging time influence
16. Effect of indium addition on mechanical, thermal, and soldering properties of eutectic Sn–9Zn alloy10.1016/j.matchemphys.2024.128992 ↗
17. Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints10.1016/j.msea.2016.07.071 ↗
18. Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy10.1016/j.jallcom.2018.01.386 ↗
19. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X= Bi, in) solders with Cu substrate10.1016/j.jallcom.2011.03.164 ↗
20. Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging10.1007/s10854-024-13436-0 ↗
21. Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: experiments and molecular dynamics simulations10.1016/j.matchar.2024.114193 ↗
22. Kinetics of intermetallic compound formation at the interface between Sn-3.0Ag-0.5Cu solder and Cu-Zn alloy substrates10.1007/s11664-010-1379-x ↗
23. Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system10.1007/s10854-016-5705-9 ↗
24. Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: experiments and first-principles calculations10.1016/j.msea.2022.143938 ↗
25. Characterization of Sn-xIn solders and thermomigration-induced interfacial IMC growth of Cu/Sn-xIn/Cu micro solder joints10.3390/electronics12081899 ↗
26. Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate10.1016/j.jallcom.2016.01.231 ↗
27. Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates10.1016/j.jallcom.2017.01.109 ↗
28. Formation and growth of intermetallic compounds in lead-free solder joints: a review10.3390/ma15041451 ↗
29. Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions10.1016/j.jallcom.2006.08.012 ↗
30. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7 Cu solder joints10.1007/s10854-017-7512-3 ↗
31. Systematics of structural, phase stability, and cohesive properties of η′-Cu6(Sn, In)5 compounds occurring in In-Sn/Cu solder joints10.1007/s11664-017-5380-5 ↗
32. Interfacial diffusion and Kirkendall voids evolution in the copper-zinc alloy binary interface revealed by in situ transmission electron microscopy10.1016/j.jallcom.2023.172018 ↗
33. Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium10.1016/j.jmst.2023.09.050 ↗
34. IMCs microstructure evolution dependence of mechanical properties for Ni/Sn/Ni micro solder-joints10.3390/ma13010252 ↗
35. Effect of in addition on microstructure, wettability and strength of SnCu solder
36. Rate-dependent behavior of Sn alloy–Cu couples: effects of microstructure and composition on mechanical shock resistance10.1016/j.actamat.2012.04.018 ↗