journal article·2026-05Open access

Microstructure, mechanical and corrosion properties of 42Sn-(57.5-x)Bi-0.5Cu-xSb alloys used as permanent plugging materials for the oil and gas extraction

Fei Huang, Dongming Tang, Xinzhong Wang, Qiang Sun, Jianjun Xue, Hongxiang Li

Abstract

Conventional Sn-Bi alloys often exhibit inferior mechanical properties due to the presence of coarse Bi-rich phase, rendering them susceptible to failure under high-temperature, high-pressure, and corrosive conditions. To address this issue, Sb element was introduced into a 42Sn-57.5Bi-0.5Cu alloy to systematically investigate its effects on microstructure, mechanical properties, and corrosion behaviors. The results indicated that Sb was dissolved in both the Bi-rich phase and β-Sn phase, and the SnSb phase with a size range of 298∼493 nm could be formed at their phase interfaces. When the Sb content was ≤1.5 wt.%, these SnSb phase particles effectively suppressed the coarsening of Bi-rich phase and Cu 6 Sn 5 phase. Consequently, the 42Sn-56Bi-0.5Cu-1.5Sb alloy exhibited an improved elongation of 71.76% and an enhanced compressive strength of 85.39 MPa at 50% strain. Although Sb addition reduced the potential difference between the phases in the alloy, the corrosion rate increased with increasing Sb content, as the formation of the SnSb phase introduced additional micro-galvanic couples. The value was only 0.094 mm/a for the 42Sn-55.5Bi-0.5Cu-1.5Sb alloy, which can still meet the requirements used in the harsh oil and gas well environments. This study provides a novel material for realizing permanent plugging in the field of oil and gas extraction.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced machining processes and optimization · Electronic Packaging and Soldering Technologies · Corrosion Behavior and Inhibition

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (51)

Show source-provided references
1. Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys10.1016/j.jallcom.2013.03.234 ↗
2. Room-temperature indentation creep of lead-free Sn–Bi solder alloys10.1007/s10854-007-9124-9 ↗
3. Khalifeh · 2020
4. Study on the deterioration mechanism of cement-based materials in acid water containing aggressive carbon dioxide10.1016/j.conbuildmat.2020.118233 ↗
5. Carbonation of cement-based materials: challenges and opportunities10.1016/j.conbuildmat.2016.05.080 ↗
6. Spatial characterization of the location of potentially leaky wells penetrating a deep saline aquifer in a mature sedimentary basin10.1007/s00254-004-1073-5 ↗
7. Degradation of oilwell cement due to exposure to carbonated brine10.1016/j.ijggc.2009.11.001 ↗
8. A comprehensive review on fly ash-based geopolymer: a pathway for sustainable future10.1080/21650373.2023.2258122 ↗
9. First application of thermal activated resin as unconventional LCM in the middle east
10. Resin-based cement alternatives for deepwater well construction
11. Remediating sustained casing pressure by forming a downhole annular seal with low-melt-point eutectic metal
12. Thorstensen · 2022
13. Numerical simulation of a patent technology for sealing of deep-sea oil wells using nonlinear finite element method10.1016/j.petrol.2015.05.010 ↗
14. Well abandonment solutions utilizing bismuth and thermite
15. Effects of alloying elements on the interfacial segregation of bismuth in tin-based solders
16. Electromigration behaviors and effects of addition elements on the formation of a Bi-rich layer in Sn58Bi-based solders10.1007/s11664-014-3400-2 ↗
17. Electromigration behaviors in Sn–58Bi solder joints under different current densities and temperatures10.1007/s10854-018-0264-x ↗
18. Effect of strain rate and temperature on tensile properties of Bi-based lead-free solder10.2320/matertrans.MD201517 ↗
19. Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and in10.1016/j.msea.2021.141131 ↗
20. Correlation between microstructure and mechanical properties of Sn–Bi–X solders10.1016/j.msea.2015.11.038 ↗
21. Low melting point solders based on Sn, Bi, and in elements
22. Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers10.1016/j.msea.2012.10.076 ↗
23. Mechanical properties of Sn58Bi–Cu composite solder filled with copper particles10.2320/matertrans.MT-M2024122 ↗
24. Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding10.1016/j.matchar.2023.113133 ↗
25. Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: experiments and first principles calculations10.1016/j.jmapro.2024.05.057 ↗
26. Significant enhancement of the overall performance of SAC joints by adding Cu@Sn@Ag core shell particles and ultrasonically assisted soldering10.1016/j.matchar.2025.114858 ↗
27. Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering10.1016/j.jmapro.2021.02.003 ↗
28. Study on the preparation and properties of Sn–0.7 Cu–x Bi alloy10.1039/D3RA06742D ↗
29. A full laboratory study on the physical and mechanical properties of a bismuth plug
30. Torres
31. Alloying regulation mechanism toward microstructure evolution of Sn-bi-based solder joint under current stress10.1016/j.matchar.2022.112094 ↗
32. The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys10.1016/j.matchar.2023.112934 ↗
33. Effect of Sb and Zn addition on the microstructures and tensile properties of Sn–Bi-based alloys10.3390/ma15030884 ↗
34. Microstructural and mechanical properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints containing TiC nanoparticle additions10.1016/j.jmrt.2025.09.213 ↗
35. Effect of Sb content on the microstructure and mechanical properties of eutectic SnPb solder10.3390/ma17102233 ↗
36. Sb additions in near-eutectic Sn-Bi solder decrease planar slip10.1007/s11664-023-10666-6 ↗
37. Effects of a third element on microstructure and mechanical properties of eutectic Sn–Bi solder10.5104/jiepeng.2.98 ↗
38. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys10.1016/j.matchar.2020.110445 ↗
39. Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
40. Low melting temperature Sn-Bi solder: effect of alloying and nanoparticle addition on the microstructural, thermal, interfacial bonding, and mechanical characteristics10.3390/met11020364 ↗
41. Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging10.1016/j.jallcom.2018.06.121 ↗
42. The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength10.1016/j.mtla.2019.100300 ↗
43. Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys10.1016/j.msea.2016.12.089 ↗
44. Microstructure and mechanical properties of Sn–58Bi eutectic alloy with Cu/P addition10.1088/2053-1591/abc4f8 ↗
45. Tensile behavior and superplastic deformation of Sn–Bi–Cu alloy10.2320/matertrans.MH201811 ↗
46. Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys10.1016/j.msea.2017.08.059 ↗
47. Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys10.1016/j.jallcom.2014.06.015 ↗
48. Effects of Cu and Sb addition on properties of Sn-Bi eutectic alloys
49. Phase constitution, microstructure and corrosion performance of binary Sn–Bi alloys10.1016/j.jmrt.2025.03.069 ↗
50. High-level integrity assessment of abandoned wells10.1016/j.egypro.2011.02.513 ↗
51. Plug and abandonment practices and trends: a British Columbia perspective10.1016/j.petrol.2019.106417 ↗