Low temperature pressureless sintering micron-Ag paste enabling high quality SiC device packaging
Source abstract
Abstract
Micron-Ag pressureless sintering faces grave challenges in high power SiC device packaging with simultaneously possessing low sintering temperature and excellent bonding strength and thermal conductivity. Herein, a cost-effective micron-Ag paste with high sintering driving force was designed and prepared by solvent engineering and preheating temperature regulation. Consequently, the optimized Ag sintered joint yields a record shear strength of 43.9 MPa at a sintering temperature of 250 °C. Furthermore, the packaged SiC device with micron-Ag paste possesses power cycle numbers of 4525 cycles, which is 1.6 times higher than that of SiC device packaged by the traditional SAC solder. The findings provide valuable guidelines to develop high quality micron-Ag paste for high power electronics packaging.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Silicon Carbide Semiconductor Technologies · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (37)
Show source-provided references
1. Development of silver paste with high sintering driving force for reliable packaging of power electronics10.1109/TCPMT.2023.3347250 ↗
2. Investigation on GaN HEMTs based three-phase STATCOM with hybrid control scheme10.3390/mi12040464 ↗
3. Review of packaging schemes for power module10.1109/JESTPE.2019.2947645 ↗
4. Strengthening mechanism of electroplated Cu layer on sintered Cu joint10.1016/j.jmrt.2025.12.051 ↗
5. Review of die-attach materials for SiC high-temperature packaging10.1109/TPEL.2024.3417529 ↗
6. Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability10.1016/j.microrel.2021.114443 ↗
7. Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging10.1007/s10854-017-8315-2 ↗
8. Analysis and modeling of thermomechanically improved silver-sintered die-attach layers modified by additives10.1109/TCPMT.2011.2167154 ↗
9. Realizing low-temperature air sintering of robust Cu-Cu joints through benzimidazole-coated in-situ Cu paste with protective encapsulation10.1016/j.jmrt.2025.11.231 ↗
10. Characterizations of a proposed 3300-V press-pack IGBT module using nanosilver paste for high-voltage applications10.1109/JESTPE.2018.2820046 ↗
11. Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste10.1186/s40580-025-00503-3 ↗
12. Characterization of multiple commercial sintered-silver pastes as die attachment for power electronics packaging: materials, processing, and properties10.1109/JESTPE.2024.3495815 ↗
13. High electrical and thermal conductivity of nano-Ag paste for power electronic applications10.1007/s40195-020-01083-3 ↗
14. Degradation mechanism of pressure-assisted sintered silver by thermal shock test10.3390/en14175532 ↗
15. Improvement of sintering performance of nanosilver paste by tin doping10.1155/2020/3925276 ↗
16. Low-pressure-assisted large-area (>800 mm2) sintered-silver bonding for high-power electronic packaging10.1109/TCPMT.2017.2773100 ↗
17. Low-temperature low-pressure die attach with hybrid silver particle paste10.1016/j.microrel.2011.07.088 ↗
18. Pressureless sintered-silver die-attach at 180°C for power electronics packaging10.1109/TPEL.2021.3074853 ↗
19. Low-temperature sintering of nanoscale silver paste for attaching large-area (>100 mm2) chips10.1109/TCAPT.2009.2021256 ↗
20. Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging10.1016/j.scriptamat.2012.01.007 ↗
21. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles10.1016/j.jmatprotec.2014.08.002 ↗
22. The pressureless sintering of micron silver paste for electrical connections10.1016/j.jallcom.2019.04.270 ↗
23. Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size10.1016/j.matdes.2018.11.062 ↗
24. Characterization of multiple commercial sintered-silver pastes as die attachment for power electronics packaging: materials, processing, and properties10.1109/JESTPE.2024.3495815 ↗
25. Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications10.1007/s10854-019-00846-8 ↗
26. Fabrication of large-area interconnects by sintering of micron Ag paste10.1016/j.matlet.2018.05.023 ↗
27. Facile preparation of stable reactive silver ink for highly conductive and flexible electrodes10.1016/j.apsusc.2018.12.261 ↗
28. Development of SiC power module structure by micron-sized ag-paste sinter joining on both die and heatsink to low-thermal-resistance and superior power cycling reliability10.1109/TPEL.2024.3408798 ↗
29. The effect of solvents on thermal stability of solder pastes in reflow process10.1007/s10853-023-08162-7 ↗
30. Pressureless sinter-joining of micron-Ag flake pastes at 160°C enabled by solvent and interface engineering10.1016/j.jmatprotec.2023.118207 ↗
31. Enhancing low-temperature and pressureless sintering of micron silver paste based on an ether-type solvent10.1007/s11664-017-5525-6 ↗
32. Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation
33. Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications10.1007/s10854-022-07728-6 ↗
34. Mechanistic prediction of the effect of microstructural coarsening on creep response of SnAgCu solder joints10.1007/s11664-016-4471-z ↗
35. Visualization of microstructural evolution in lead free solders during isothermal aging using time-lapse imagery
36. Fatigue behavior of electrically conductive adhesives10.1163/156856108X305516 ↗
37. Fatigue crack networks in die-attach layers of IGBT modules under a power cycling test10.1109/TPEL.2024.3447909 ↗