Research progress in single-crystal copper preparation: A review

This paper reviews the preparation principles, major processing methods, and current development status of single-crystal copper. The fundamental principles and performance advantages of single-crystal copper preparation are discussed, emphasizing that its low resistivity, high thermal conductivity, and excellent ductility originate from its grain-boundary-free structure. Subsequently, traditional preparation methods are systematically summarized, and their characteristics and limitations in crystal size control, orientation regulation, and cost are analyzed. Furthermore, emerging continuous preparation technologies in recent years provide new pathways for the efficient fabrication of large-sized, highly oriented single-crystal copper. Meanwhile, data-driven process optimization and intelligent control are enabling precise adjustment of processing parameters and enhancing process predictability. In terms of applications, single-crystal copper serves as a key high-performance conductive material and an essential substrate for the epitaxial growth of two-dimensional crystals, offering significant engineering value. Finally, this review discusses the future prospects of single-crystal copper preparation technology in the controlled synthesis of high-performance two-dimensional materials and the reliable fabrication of flexible devices.