journal article·2022-12-27

Electroless Metallization of the Elements: Survey and Progress

Claudia Turro, Walter J. Dressick

ACS Applied Electronic Materials· Volume 4· Issue 12
Publisher page

Abstract

The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Electrodeposition and Electroless Coatings · Electrocatalysts for Energy Conversion · Molecular Junctions and Nanostructures

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

The Ohio State University Department of Chemistry & Biochemistry Columbus, Ohio 43210, United States

Funding

Ohio State University

References (100+)

Show source-provided references
1. 10.1002/pssa.221087010510.1002/pssa.2210870105 ↗
2. 10.1016/S0013-4686(00)00403-510.1016/S0013-4686(00)00403-5 ↗
3. 10.1021/cm040178a10.1021/cm040178a ↗
4. 10.1149/1.218676710.1149/1.2186767 ↗
5. 10.1039/b902882j10.1039/b902882j ↗
6. 10.1149/1945-7111/ac371a10.1149/1945-7111/ac371a ↗
7. 10.1038/s41598-021-90939-410.1038/s41598-021-90939-4 ↗
8. 10.1021/acs.inorgchem.0c0308610.1021/acs.inorgchem.0c03086 ↗
9. 10.1021/cm061000m10.1021/cm061000m ↗
10. 10.1021/nn800441y10.1021/nn800441y ↗
11. 10.1002/pip.91410.1002/pip.914 ↗
12. 10.1021/acs.langmuir.9b0343610.1021/acs.langmuir.9b03436 ↗
13. 10.1023/A:101149642954010.1023/A:1011496429540 ↗
14. 10.1016/S0167-2738(02)00604-510.1016/S0167-2738(02)00604-5 ↗
15. 10.2109/jcersj2.117.22810.2109/jcersj2.117.228 ↗
16. 10.1016/j.cap.2010.07.00710.1016/j.cap.2010.07.007 ↗
17. 10.1557/jmr.2013.1310.1557/jmr.2013.13 ↗
18. 10.1016/j.mee.2014.09.00310.1016/j.mee.2014.09.003 ↗
19. Wurtz A. · C.R. Acad. Sci. · 1844 · 18 · 702
20. Wurtz A. · Ann. Chim. Phys. · 1846 · 190
21. Breteau P. · Bull. Soc. Chim. · 1911 · 9 · 515
22. Breteau P. · Bull. Soc. Chim. · 1911 · 9 · 518
23. 10.1002/cber.1931064073510.1002/cber.19310640735 ↗
24. 10.6028/jres.037.01910.6028/jres.037.019 ↗
25. 10.6028/jres.039.02410.6028/jres.039.024 ↗
26. 10.1149/1.277382010.1149/1.2773820 ↗
27. 10.1149/1.277569410.1149/1.2775694 ↗
28. 10.1149/1.242854110.1149/1.2428541 ↗
29. 10.1063/1.171704910.1063/1.1717049 ↗
30. 10.1149/1.242821310.1149/1.2428213 ↗
31. 10.1179/174591911X1317117448123910.1179/174591911X13171174481239 ↗
32. 10.1007/s12633-015-9367-710.1007/s12633-015-9367-7 ↗
33. 10.1039/C6RA25841G10.1039/C6RA25841G ↗
34. 10.1080/09506608.2018.150669210.1080/09506608.2018.1506692 ↗
35. 10.1021/jp205751v10.1021/jp205751v ↗
36. 10.1016/j.electacta.2018.12.02610.1016/j.electacta.2018.12.026 ↗
37. Shakoor R. A. · Int. J. Electrochem. Sci. · 2016 · 11 · 248610.1016/S1452-3981(23)16119-0 ↗
38. 10.1016/j.matdes.2010.11.01310.1016/j.matdes.2010.11.013 ↗
39. 10.1016/j.surfin.2020.10070210.1016/j.surfin.2020.100702 ↗
40. 10.1016/j.tsf.2018.11.01610.1016/j.tsf.2018.11.016 ↗
41. 10.1016/j.surfin.2020.10070410.1016/j.surfin.2020.100704 ↗
42. 10.1179/1743294414Y.000000028110.1179/1743294414Y.0000000281 ↗
43. 10.5796/electrochemistry.73.12310.5796/electrochemistry.73.123 ↗
44. 10.22382/wfs-2019-01610.22382/wfs-2019-016 ↗
45. 10.1016/S0167-9317(03)00325-310.1016/S0167-9317(03)00325-3 ↗
46. 10.5796/electrochemistry.74.210.5796/electrochemistry.74.2 ↗
47. 10.1021/am800121d10.1021/am800121d ↗
48. 10.1002/asia.20110094610.1002/asia.201100946 ↗
49. 10.7567/JJAP.53.05GA1110.7567/JJAP.53.05GA11 ↗
50. 10.1149/2.0061504jss10.1149/2.0061504jss ↗
51. Żenkiewicz M. · Arch. Mater. Sci. Eng. · 2015 · 74 · 67
52. 10.1002/adma.20190298710.1002/adma.201902987 ↗
53. Ryder K. S. · 2020 · 49 · 278
54. 10.1002/tcr.2002510.1002/tcr.20025 ↗
55. 10.1016/j.apsusc.2019.02.00310.1016/j.apsusc.2019.02.003 ↗
56. 10.1007/s10853-013-7643-810.1007/s10853-013-7643-8 ↗
57. 10.1007/s00542-020-04912-810.1007/s00542-020-04912-8 ↗
58. Madou, M. J.Fundamentals of Microfabrication: The Science of Miniaturization, 2nd ed. CRC Press: Boca Raton, FL, 2002; pp 183–258.
59. Osaka T. · 2009 · 32110.1007/978-0-387-73582-5_8 ↗
60. 10.1002/smll.20200409910.1002/smll.202004099 ↗
61. 10.21468/SciPostPhys.5.4.03810.21468/SciPostPhys.5.4.038 ↗
62. 10.1016/j.matchemphys.2021.12544310.1016/j.matchemphys.2021.125443 ↗
63. 10.1016/j.jallcom.2021.16119110.1016/j.jallcom.2021.161191 ↗
64. 10.1038/s41598-022-15961-610.1038/s41598-022-15961-6 ↗
65. 10.1088/2058-8585/ac6b6e10.1088/2058-8585/ac6b6e ↗
66. 10.1111/1556-4029.1252410.1111/1556-4029.12524 ↗
67. 10.1021/acs.analchem.6b0371210.1021/acs.analchem.6b03712 ↗
68. 10.1002/anie.20140441610.1002/anie.201404416 ↗
69. 10.1039/c000358a10.1039/c000358a ↗
70. Uhlmann, E.; Schulze, N. F. S.; Polte, J.; Hein, C.; Matthiesen, J.; Boge, M. InMicro formed holographic security features in steel, Fifth International Conference on New Forming Technology (ICNFT 2018), Bremen, Germany, 18–21 Bremen, Germany; Vollertsen, F., Dean, T. A., Qin, Y., Yuan, S. J., Eds. Curran Associates Inc.: Bremen, Germany, 2018; pp 1–4 (10002).10.1051/matecconf/201819010002 ↗
71. 10.1021/am800116d10.1021/am800116d ↗
72. 10.1039/c3cc00207a10.1039/c3cc00207a ↗
73. 10.1166/jnn.2014.958210.1166/jnn.2014.9582 ↗
74. 10.1021/acsami.6b0418710.1021/acsami.6b04187 ↗
75. 10.1016/j.apsusc.2016.05.12810.1016/j.apsusc.2016.05.128 ↗
76. 10.3390/polym906021810.3390/polym9060218 ↗
77. 10.1016/j.apsusc.2012.01.09310.1016/j.apsusc.2012.01.093 ↗
78. 10.1007/s12221-013-0459-y10.1007/s12221-013-0459-y ↗
79. 10.1002/app.3679910.1002/app.36799 ↗
80. 10.1007/s10854-014-1919-x10.1007/s10854-014-1919-x ↗
81. 10.1007/s00226-014-0643-210.1007/s00226-014-0643-2 ↗
82. 10.1016/j.apsusc.2019.06.17110.1016/j.apsusc.2019.06.171 ↗
83. 10.1016/j.apsusc.2020.14585710.1016/j.apsusc.2020.145857 ↗
84. 10.1021/acsami.0c1747910.1021/acsami.0c17479 ↗
85. 10.1021/ja505741e10.1021/ja505741e ↗
86. 10.1021/acs.jpcb.0c0380510.1021/acs.jpcb.0c03805 ↗
87. 10.1021/acsami.0c1851810.1021/acsami.0c18518 ↗
88. 10.1002/smll.20180122610.1002/smll.201801226 ↗
89. 10.3390/ma1401009210.3390/ma14010092 ↗
90. 10.1016/j.apsusc.2021.14921810.1016/j.apsusc.2021.149218 ↗
91. 10.1021/jp101542j10.1021/jp101542j ↗
92. 10.1002/anie.20110350510.1002/anie.201103505 ↗
93. 10.1021/am401252h10.1021/am401252h ↗
94. 10.1016/j.jcis.2014.09.01710.1016/j.jcis.2014.09.017 ↗
95. 10.1021/jp410293j10.1021/jp410293j ↗
96. 10.1021/acsami.5b1061910.1021/acsami.5b10619 ↗
97. 10.1021/acs.jpclett.0c0262410.1021/acs.jpclett.0c02624 ↗
98. 10.1016/j.vacuum.2021.11009610.1016/j.vacuum.2021.110096 ↗
99. 10.1016/j.colsurfa.2021.12631010.1016/j.colsurfa.2021.126310 ↗
100. 10.1007/s10854-014-1732-610.1007/s10854-014-1732-6 ↗