The Cu–Sn multilevel gradient heterogeneous interface interpenetrative growth mechanism and its regulation strategies
Source abstract
Abstract
This study investigates the microstructural characteristics of the heterogeneous interface of hot-dip Sn-plated Cu subjected to multistage heat treatment. The findings reveal that, under thermal stress, the phases at the heterogeneous interface exhibit competitive growth. As the diffusion energy of Cu atoms diminishes, the interface undergoes self-stabilization, gradually evolving toward a more stable configuration.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · High Temperature Alloys and Creep
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
Show source-provided references
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