Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
Source abstract
Abstract
Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are compared.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (14)
Show source-provided references
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