Feasibility study of single-crystal silicon ductile-regime turning via fast tool servo
Source abstract
Abstract
Due to the material properties of single-crystal silicon, it is difficult to achieve high-efficiency processing in conventional turning. Fast tool servo (FTS) turning has emerged as a favorable technology for processing brittle materials. This paper investigates the tool radius, feed speed, and cutting depth effects on the maximum undeformed chip thickness (MUCT). A high-frequency low-coupling FTS system is designed for processing experiments. Effects of the tool rake angle, tool radius, cutting speed, and vibration frequency on the critical undeformed chip thickness (CUCT) are explored in this paper. Experimental results indicate FTS technology can increase the CUCT from 80 nm to 580 nm. Surface and subsurface morphology tests of conventional and FTS single-crystal silicon cutting verify that FTS technology can obtain an optical surface roughness of 5 nm and lower subsurface damage. Moreover, FTS turning can reduce tool wear. Lastly, through Raman spectroscopy analysis, the amorphous phase remaining on the machined surface is lower when FTS turning is employed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Force Microscopy Techniques and Applications · Advanced machining processes and optimization
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (43)
Show source-provided references
1. On form accuracy and surface roughness in micro-ultrasonic machining of silicon microchannels10.1016/j.precisioneng.2018.04.014 ↗
2. Observations on polishing and ultraprecision machining of semiconductor substrate materials10.1016/S0007-8506(07)60508-3 ↗
3. Abrasive machining of silicon10.1016/S0007-8506(07)62999-0 ↗
4. Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo10.1016/j.ijmachtools.2016.11.004 ↗
5. Ductile regime turning at large tool feed10.1016/S0924-0136(01)01218-3 ↗
6. Feasibility study of the novel quasi-elliptical tool servo for vibration suppression in the turning of micro-lens arrays10.1016/j.ijmachtools.2017.06.004 ↗
7. Ultraprecision machining of micro-structured functional surfaces on brittle materials10.1088/0960-1317/21/9/095011 ↗
8. Ductile-regime machining of germanium and silicon10.1111/j.1151-2916.1990.tb05142.x ↗
9. Ductile-regime machining model for diamond turning of brittle materials10.1016/0141-6359(91)90500-I ↗
10. Brittle-ductile transition phenomena in microindentation and micromachining10.1016/S0007-8506(07)62377-4 ↗
11. Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments10.1016/j.mssp.2017.10.027 ↗
12. On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications10.1016/S0921-5093(00)01031-5 ↗
13. Numerical investigation on material removal mechanism in elliptical vibration cutting of single-crystal silicon10.1016/j.mssp.2021.106019 ↗
14. Feasibility investigation on ductile machining of single-crystal silicon for deep micro-structures by ultra-precision fly cutting10.1016/j.jmapro.2019.05.045 ↗
15. Study on elliptical vibration cutting10.1016/S0007-8506(07)62158-1 ↗
16. Ultrasonic assisted turning of mild steels10.1504/IJMPT.2010.029459 ↗
17. Evaluation on advantages of low frequency assisted drilling (LFAD) aluminium alloy Al7075
18. Research on the promotion mechanism of surface burnishing process by two-dimensional ultrasonic vibration10.1016/j.jmrt.2021.05.038 ↗
19. Microstructural evolution and surface integrity of ultrasonic surface rolling in Ti6Al4V alloy10.1016/j.jmrt.2021.05.065 ↗
20. Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: a molecular dynamics approach10.1016/j.mssp.2019.104868 ↗
21. A novel method for determination of the subsurface damage depth in diamond turning of brittle materials10.1016/j.ijmachtools.2011.08.007 ↗
22. Zirconia responses to edge chipping damage induced in conventional and ultrasonic vibration-assisted diamond machining10.1016/j.jmrt.2021.05.005 ↗
23. Machining approach of freeform optics on infrared materials via ultra-precision turning10.1364/OE.25.002051 ↗
24. Auto-tracking single point diamond cutting on non-planar brittle material substrates by a high-rigidity force controlled fast tool servo10.1016/j.precisioneng.2017.02.014 ↗
25. Tuned diamond turning of micro-structured surfaces on brittle materials for the improvement of machining efficiency
26. A novel polishing method for single-crystal silicon using the cavitation rotary abrasive flow10.1016/j.precisioneng.2019.10.002 ↗
27. Fundamental study of ductile-regime diamond turning of single crystal gallium arsenide10.1016/j.precisioneng.2019.11.010 ↗
28. Development of piezo-actuated Two-Degree-of-Freedom fast tool servo system10.3390/mi10050337 ↗
29. Effects of the friction coefficient on the minimum cutting thickness in micro cutting10.1016/j.ijmachtools.2004.09.001 ↗
30. Ductile-mode grinding: a new technology for machining brittle materials
31. Theoretical modelling and FE simulation on the oblique diamond turning of ZnS crystal10.1016/j.ijmachtools.2015.10.002 ↗
32. Ductile-regime machining model for ultrasonic elliptical vibration cutting of brittle materials10.1016/j.jmapro.2018.09.029 ↗
33. Critical undeformed chip thickness of brittle materials in single point diamond turning10.1007/s00170-015-7264-2 ↗
34. An empirical tool force model for precision machining10.1115/1.2830209 ↗
35. Liu · 2002
36. Predictive cutting force model for ductile-regime machining of brittle materials10.1007/s00170-018-2273-6 ↗
37. Fracture mechanisms induced in a brittle material by a hard cutting indenter10.1016/S0020-7683(01)00117-2 ↗
38. Experimental study of surface generation and force modeling in micro-grinding of single crystal silicon considering crystallographic effects10.1016/j.ijmachtools.2013.10.003 ↗
39. Raman microspectroscopy study of processing-induced phase transformations and residual stress in silicon10.1088/0268-1242/14/10/310 ↗
40. Roughness prediction on laser polished surfaces10.1016/j.jmatprotec.2012.01.007 ↗
41. Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy10.1016/j.precisioneng.2007.08.006 ↗
42. Subsurface deformation of germanium in ultra-precision cutting: characterization of micro-Raman spectroscopy10.1007/s00170-016-9749-z ↗
43. A critical review on the chemical wear and wear suppression of diamond tools in diamond cutting of ferrous metals