Graphene-Enhanced Screen-Printed BiFeO3-Based Thermistors
Source abstract
Abstract
In this study, serigraphic-grade BiFeO3-based ink formulations are produced and then mixed with graphene to enhance the performances of screen-printed thermistor devices. The devices are printed atop a standard thermally boosted glass-reinforced epoxy (FR-4) substrate coated with interdigitated gold electrodes. The broader operating temperature range of these thermistors makes them compatible with standard printed circuit board (PCB) manufacturing and operating conditions. Thus, we achieve highly sensitive devices with a temperature coefficient of resistance (TCR) of −0.96%/°C, which is the highest sensitivity reported yet for any graphene-based thermistor operating from 25 to 170 °C. The best-performing devices are loaded with 3.5 wt % graphene. These low-hysteresis and stable thermistors boast a thermal index (β-coefficient) of 864 K. This optimal graphene loading occurs just above the percolation threshold.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Ferroelectric and Piezoelectric Materials · Advanced Sensor and Energy Harvesting Materials · Electrical and Thermal Properties of Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electrical Engineering, École de Technologie Supérieure, 1100 Notre Dame Street West, Montreal, QuebecH3C 1K3, Canada
Funding
Minist?re de la D?fense Nationale · Canada Research Chairs · Natural Sciences and Engineering Research Council of Canada
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