journal article·2024-09-24

Multilevel Resistive Switching in Flexible RRAM Devices with a PVP:MoSe2 Active Layer

Shalu Saini, Anurag Dwivedi, Anil Lodhi, Arpit Khandelwal, Shree Prakash Tiwari

Publisher page

Abstract

In this work, a unique composite of a polymer and two-dimensional material (PVP:MoSe 2 ) is demonstrated as a potential resistive switching layer for flexible resistive random-access memory (RRAM) devices, exhibiting multilevel switching. Fabricated flexible RRAM devices exhibit forming-free and excellent resistive switching with low SET and RESET voltages (0.7 V/∼−1 V), high DC endurance of more than 1000 cycles, and an excellent retention time of 10 4 seconds with decent I ON /I OFF (∼10 3 ). These devices exhibit multilevel resistive switching for 2-bit storage (four levels), by tuning the compliance current values, which can be the simplest way to achieve this functionality. Moreover, these devices exhibit high stability in performance upon bending, as explored up to a low bending radius of 7 mm. Our results indicate that the composites of PVP and MoSe 2, a rarely explored transition metal dichalcogenide, can be a great choice as switching layer for flexible electronics. Further, this study also opens up a direction for exploration of other unique material combinations for switching layers toward application in multibit storage, as it may contribute to low-cost, high-density, and nonvolatile flexible RRAM devices.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Neuroscience and Neural Engineering

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Flexible Large Area Microelectronics (FLAME) Research Group, Department of Electrical Engineering, Indian Institute of Technology Jodhpur, Jodhpur, Rajasthan 342037, India

Funding

Ministry of Electronics and Information technology · Science and Engineering Research Board

References (49)

Show source-provided references
1. 10.1002/adma.20231050510.1002/adma.202310505 ↗
2. 10.1021/acsanm.3c0339710.1021/acsanm.3c03397 ↗
3. 10.1109/TED.2023.326562210.1109/TED.2023.3265622 ↗
4. 10.1109/TED.2021.308455410.1109/TED.2021.3084554 ↗
5. 10.1109/TED.2019.295988310.1109/TED.2019.2959883 ↗
6. 10.1186/s11671-017-2164-z10.1186/s11671-017-2164-z ↗
7. 10.1002/aelm.20230091110.1002/aelm.202300911 ↗
8. 10.1021/acsami.9b1716010.1021/acsami.9b17160 ↗
9. 10.1109/JPROC.2012.219036910.1109/JPROC.2012.2190369 ↗
10. 10.1002/aelm.20180014310.1002/aelm.201800143 ↗
11. 10.1016/j.ssc.2022.11467710.1016/j.ssc.2022.114677 ↗
12. 10.1016/j.orgel.2016.12.00710.1016/j.orgel.2016.12.007 ↗
13. 10.1109/TED.2022.322135510.1109/TED.2022.3221355 ↗
14. 10.1002/adma.20230534410.1002/adma.202305344 ↗
15. 10.1021/acsnano.5b0219910.1021/acsnano.5b02199 ↗
16. 10.1002/aelm.20210101810.1002/aelm.202101018 ↗
17. 10.1038/s41928-020-00473-w10.1038/s41928-020-00473-w ↗
18. 10.1109/TED.2020.296491010.1109/TED.2020.2964910 ↗
19. 10.1063/1.368136610.1063/1.3681366 ↗
20. 10.1016/j.matdes.2022.11121810.1016/j.matdes.2022.111218 ↗
21. 10.1039/C9NR00747D10.1039/C9NR00747D ↗
22. 10.1016/j.carbon.2023.01.04010.1016/j.carbon.2023.01.040 ↗
23. 10.1002/aelm.20190046710.1002/aelm.201900467 ↗
24. 10.1021/acsmaterialslett.3c0001310.1021/acsmaterialslett.3c00013 ↗
25. 10.1038/srep3619510.1038/srep36195 ↗
26. 10.1002/smll.20150382710.1002/smll.201503827 ↗
27. 10.1007/s10854-016-4744-610.1007/s10854-016-4744-6 ↗
28. Saini, S.; Dwivedi, A.; Lodhi, A.; Khandelwal, A.; Tiwari, S. P. Flexible Forming Free Resistive Memory Device with 2D Material MoSe2as Switching Layer. In 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023; IEEE, 2023,10.1109/EDTM55494.2023.10103025.10.1109/EDTM55494.2023.10103025 ↗
29. 10.1002/smll.20180543110.1002/smll.201805431 ↗
30. 10.1016/j.jallcom.2019.07.21710.1016/j.jallcom.2019.07.217 ↗
31. 10.1109/TED.2020.300385410.1109/TED.2020.3003854 ↗
32. 10.1109/JSTQE.2017.276546110.1109/JSTQE.2017.2765461 ↗
33. 10.1002/adma.20170133310.1002/adma.201701333 ↗
34. 10.1186/s11671-020-03299-910.1186/s11671-020-03299-9 ↗
35. 10.1002/adfm.20230659310.1002/adfm.202306593 ↗
36. 10.1016/j.jallcom.2021.16218010.1016/j.jallcom.2021.162180 ↗
37. 10.1002/pssa.20170057010.1002/pssa.201700570 ↗
38. 10.1109/TED.2022.320625510.1109/TED.2022.3206255 ↗
39. 10.1109/TED.2024.338340810.1109/TED.2024.3383408 ↗
40. 10.1016/j.memori.2023.10002910.1016/j.memori.2023.100029 ↗
41. 10.1016/j.jallcom.2022.16660710.1016/j.jallcom.2022.166607 ↗
42. 10.1021/acsaelm.1c0032910.1021/acsaelm.1c00329 ↗
43. 10.1002/admt.20180034210.1002/admt.201800342 ↗
44. 10.1039/C5RA15581A10.1039/C5RA15581A ↗
45. 10.1109/JFLEX.2023.328948110.1109/JFLEX.2023.3289481 ↗
46. 10.1016/j.cplett.2015.08.03510.1016/j.cplett.2015.08.035 ↗
47. 10.1016/j.jallcom.2015.12.23810.1016/j.jallcom.2015.12.238 ↗
48. 10.1002/aelm.20210090510.1002/aelm.202100905 ↗
49. 10.1016/j.jallcom.2022.16410310.1016/j.jallcom.2022.164103 ↗