DataVXACS Applied Electronic MaterialsPaper
journal article·2021-10-26

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

Sri Krishna Bhogaraju, Hiren R. Kotadia, Fosca Conti, Armin Mauser, Thomas Rubenbauer, Robert Bruetting, Martin Schneider-Ramelow, Gordon Elger

ACS Applied Electronic Materials· Volume 3· Issue 10
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Abstract

4587
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Aluminum Alloys Composites Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Esplanade 10, 85049 Ingolstadt, Germany

WMG (Warwick Manufacturing Group), The University of Warwick, Coventry CV4 7AL, United Kingdom

School of Engineering, Liverpool John Moores University, Liverpool L3 3AF, United Kingdom

Department of Chemical Sciences, University of Padova, Via Marzolo 1, 35131 Padova, Italy

Schlenk Metallic Pigments GmbH, Barnsdorfer Hauptstraße 5, 91154 Roth, Germany

Technical University of Berlin, 10623 Berlin, Germany

Funding

Bundesministerium f??r Bildung und Forschung

References (41)

Show source-provided references
1. 10.1007/s00542010010310.1007/s005420100103 ↗
2. 10.1109/TCPMT.2010.210043210.1109/TCPMT.2010.2100432 ↗
3. 10.1115/1.403306910.1115/1.4033069 ↗
4. 10.1007/s11664-013-2967-310.1007/s11664-013-2967-3 ↗
5. 10.1016/j.jallcom.2021.15878310.1016/j.jallcom.2021.158783 ↗
6. 10.1533/9781845699949.1.310.1533/9781845699949.1.3 ↗
7. Kang S.-J. · 2004
8. 10.1109/ECTC.2019.0002010.1109/ECTC.2019.00020 ↗
9. 10.1007/s12540-020-00806-610.1007/s12540-020-00806-6 ↗
10. 10.1016/j.scriptamat.2016.04.01810.1016/j.scriptamat.2016.04.018 ↗
11. 10.1016/j.apt.2020.08.01910.1016/j.apt.2020.08.019 ↗
12. 10.1007/s10854-020-04026-x10.1007/s10854-020-04026-x ↗
13. 10.1016/j.jallcom.2020.15604310.1016/j.jallcom.2020.156043 ↗
14. 10.1016/j.scriptamat.2020.02.04510.1016/j.scriptamat.2020.02.045 ↗
15. 10.1007/s11595-020-2312-710.1007/s11595-020-2312-7 ↗
16. Naumkin, A. V; Kraut-Vass, A.; Gaarenstroom, S. W.; Powell, C. J. National Institute of Standards and Technology (NIST); NIST, Standard Database 20, Version 4.1 (Web Version) https://srdata.nist.gov/xps/.
17. 10.1007/s10853-019-03813-010.1007/s10853-019-03813-0 ↗
18. 10.1515/CORRREV.2003.21.1.4110.1515/CORRREV.2003.21.1.41 ↗
19. 10.1016/B978-0-12-409547-2.13429-810.1016/B978-0-12-409547-2.13429-8 ↗
20. 10.1007/s10973-014-3929-610.1007/s10973-014-3929-6 ↗
21. 10.1016/j.jtice.2021.06.02610.1016/j.jtice.2021.06.026 ↗
22. 10.2320/matertrans.MI20141110.2320/matertrans.MI201411 ↗
23. 10.1007/s11664-012-2354-510.1007/s11664-012-2354-5 ↗
24. Bhogaraju, S. K.; Conti, F.; Schmid, M.; Meier, M. R.; Schweigart, H.; Elger, G. Development of Sinter Paste with Surface Modified Copper Alloy Particles for Die-Attach Bonding. In CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems; VDE, 2020, pp. 582–587.
25. 10.1002/sia.623910.1002/sia.6239 ↗
26. 10.1002/(SICI)1096-9918(199611)24:12<811::AID-SIA191>3.0.CO;2-Z10.1002/(SICI)1096-9918(199611)24:12<811::AID-SIA191>3.0.CO;2-Z ↗
27. 10.1039/c5cp04354a10.1039/c5cp04354a ↗
28. 10.1016/j.susc.2013.12.01110.1016/j.susc.2013.12.011 ↗
29. 10.1039/DC975600008910.1039/DC9756000089 ↗
30. 10.1109/ESTC48849.2020.922980110.1109/ESTC48849.2020.9229801 ↗
31. 10.1016/j.powtec.2004.05.00710.1016/j.powtec.2004.05.007 ↗
32. 10.1179/mtlr.1967.12.1.6910.1179/mtlr.1967.12.1.69 ↗
33. 10.1007/978-94-009-0741-6_3310.1007/978-94-009-0741-6_33 ↗
34. 10.1016/b978-0-12-401682-8.00007-010.1016/b978-0-12-401682-8.00007-0 ↗
35. 10.1007/BF0112994210.1007/BF01129942 ↗
36. 10.23919/ICEP51988.2021.945196610.23919/ICEP51988.2021.9451966 ↗
37. 10.1007/s11664-017-5525-610.1007/s11664-017-5525-6 ↗
38. 10.3390/app1023851610.3390/app10238516 ↗
39. 10.1007/978-3-319-45098-810.1007/978-3-319-45098-8 ↗
40. 10.1063/1.509914010.1063/1.5099140 ↗
41. 10.1016/0039-6028(80)90439-210.1016/0039-6028(80)90439-2 ↗