Neutral Oxygen Beam Treated ZnO-Based Resistive Switching Memory Device
Source abstract
Abstract
The room-temperature oxidation process allows irradiation with neutral oxygen particles onto the resistive layer that leads to the absorption of oxygen by the surface of the ZnO layer. The irradiation is effective in controlling the defect concentrations; thus, the ON and OFF resistances of devices can be significantly increased. These characteristics promote the occurrence of resistive switching at much lower current compliance as well as induce switching behavior in very thin ZnO films with thicknesses of 14–42 nm. The thickness dependence of the transformation from filamentary to homogeneous switching was also studied using the neutral beam technique, and the underlying mechanism is discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Transition Metal Oxide Nanomaterials · Ferroelectric and Negative Capacitance Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
World Premier Institute (WPI) − Advanced Institute for Materials Research, Tohoku University, Sendai 980-8577, Japan
Department of Innovative Engineering, Oita University, Oita 870-1192, Japan
Institute of Fluid Science, Tohoku University, Sendai 980-8577, Japan
Funding
Ministry of Education, Culture, Sports, Science and Technology
References (30)
Show source-provided references
1. 10.1002/adma.20090037510.1002/adma.200900375 ↗
2. 10.1039/C6RA10503C10.1039/C6RA10503C ↗
3. 10.1186/s11671-017-2419-810.1186/s11671-017-2419-8 ↗
4. 10.1038/srep0440210.1038/srep04402 ↗
5. 10.3390/mi611145310.3390/mi6111453 ↗
6. 10.1186/s11671-016-1570-y10.1186/s11671-016-1570-y ↗
7. 10.1088/1361-6528/aa80b410.1088/1361-6528/aa80b4 ↗
8. 10.1063/1.494859810.1063/1.4948598 ↗
9. Prall, K.; Ramaswamy, N.; Kinney, W.; Holtzclaw, K.; Chen, X.; Strand, J.; Bez, R. An Update on Emerging Memory: Progress to 2Xnm. In 2012 4th IEEE International Memory Workshop; IEEE, 2012; pp 1–5.10.1109/IMW.2012.6213635 ↗
10. 10.1021/acsami.7b1369410.1021/acsami.7b13694 ↗
11. 10.7567/APEX.6.07650110.7567/APEX.6.076501 ↗
12. 10.1039/c3tc31320d10.1039/c3tc31320d ↗
13. 10.1016/j.rinp.2017.12.00110.1016/j.rinp.2017.12.001 ↗
14. 10.1063/1.491972410.1063/1.4919724 ↗
15. 10.1007/s13391-013-2244-x10.1007/s13391-013-2244-x ↗
16. 10.1155/2014/57816810.1155/2014/578168 ↗
17. 10.1007/s10853-015-9247-y10.1007/s10853-015-9247-y ↗
18. 10.1088/0957-4484/22/27/27520410.1088/0957-4484/22/27/275204 ↗
19. 10.1063/1.500362210.1063/1.5003622 ↗
20. 10.1063/1.492728410.1063/1.4927284 ↗
21. 10.1143/JJAP.41.2810.1143/JJAP.41.28 ↗
22. 10.1109/LED.2011.216771010.1109/LED.2011.2167710 ↗
23. 10.1039/C6RA21726E10.1039/C6RA21726E ↗
24. 10.1021/am400728710.1021/am4007287 ↗
25. 10.1088/0022-3727/43/39/39510410.1088/0022-3727/43/39/395104 ↗
26. 10.1088/1367-2630/12/2/02300810.1088/1367-2630/12/2/023008 ↗
27. 10.1063/1.327332910.1063/1.3273329 ↗
28. 10.1109/LED.2011.216231110.1109/LED.2011.2162311 ↗
29. 10.1002/pssr.20100436410.1002/pssr.201004364 ↗
30. 10.1088/1361-6641/aa959810.1088/1361-6641/aa9598 ↗