journal article·2022-04-26

Printing Nanostructured Copper for Electromagnetic Interference Shielding

Aaron Sheng, Jian Yu, Shenqiang Ren

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Abstract

Printing metallic nanomaterials toward electromagnetic interference shielding is highly desirable, especially with a minimal thickness and mechanical flexibility. Here, we report the geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding. The electromagnetic interference shielding is observed to increase as the conductivity increases with the optimum electromagnetic interference shielding effectiveness of 65 dB, on which a shielding effectiveness diagram is constructed to illustrate the role of electric conductivity and architectures of printed nanostructured copper features. The findings reported here provide insight into printed flexible metallic materials for electromagnetic interference shielding.
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Research context

OpenAlex topics: Electromagnetic wave absorption materials · Advanced Antenna and Metasurface Technologies · Aluminum Alloys Composites Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

Army Research Laboratory, Aberdeen Proving Ground, Maryland 21005, United States

Department of Mechanical and Aerospace Engineering, Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

Funding

Army Research Laboratory

References (31)

Show source-provided references
1. 10.1021/acsnano.0c0735210.1021/acsnano.0c07352 ↗
2. 10.1016/j.matchemphys.2020.12358710.1016/j.matchemphys.2020.123587 ↗
3. 10.3390/ma1414377410.3390/ma14143774 ↗
4. 10.1016/j.mtadv.2020.10012410.1016/j.mtadv.2020.100124 ↗
5. 10.1016/j.polymertesting.2020.10674410.1016/j.polymertesting.2020.106744 ↗
6. 10.1186/s40537-019-0268-210.1186/s40537-019-0268-2 ↗
7. 10.1016/j.cej.2021.12976310.1016/j.cej.2021.129763 ↗
8. 10.1016/j.compositesa.2018.08.00610.1016/j.compositesa.2018.08.006 ↗
9. 10.1039/C6RA04765C10.1039/C6RA04765C ↗
10. 10.1016/j.compositesa.2010.08.00610.1016/j.compositesa.2010.08.006 ↗
11. Ceken F. · Tekstil -Zagreb- · 2011 · 60 · 321
12. 10.1016/j.compositesb.2019.10720710.1016/j.compositesb.2019.107207 ↗
13. 10.1002/app.2981210.1002/app.29812 ↗
14. 10.1002/adma.20190715610.1002/adma.201907156 ↗
15. 10.1007/s40820-020-00552-910.1007/s40820-020-00552-9 ↗
16. Altin, Y.; Bedeloglu, A. In Materials for Potential EMI Shielding Applications; Joseph, K., Wilson, R., George, G., Eds. Elsevier: 2020; Chapter 11, pp 179–199.10.1016/B978-0-12-817590-3.00011-7 ↗
17. 10.1016/j.matt.2019.04.00610.1016/j.matt.2019.04.006 ↗
18. 10.1039/D0MA00751J10.1039/D0MA00751J ↗
19. 10.1021/acsami.6b0645510.1021/acsami.6b06455 ↗
20. 10.1016/j.compositesa.2019.10569310.1016/j.compositesa.2019.105693 ↗
21. 10.1016/j.mtcomm.2017.02.00610.1016/j.mtcomm.2017.02.006 ↗
22. 10.1039/C5TC02591E10.1039/C5TC02591E ↗
23. 10.1016/j.compositesa.2010.10.00310.1016/j.compositesa.2010.10.003 ↗
24. 10.1002/smll.20180063410.1002/smll.201800634 ↗
25. Zhang, N.; Li, M. In Microstructure Characteristics and Properties of Copper Films Sputtered in EMI Shielding Layer, 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 12–15 Aug 2020; 2020; pp 1–4.10.1109/ICEPT50128.2020.9202580 ↗
26. 10.1016/j.mseb.2022.11561110.1016/j.mseb.2022.115611 ↗
27. 10.3390/nano1001010710.3390/nano10010107 ↗
28. 10.1002/adma.20180493010.1002/adma.201804930 ↗
29. 10.3390/coatings808027810.3390/coatings8080278 ↗
30. 10.1021/acs.chemmater.0c0359610.1021/acs.chemmater.0c03596 ↗
31. 10.1016/j.jcis.2007.03.03910.1016/j.jcis.2007.03.039 ↗