The influence of porosity on whisker growth in electroplated tin films
Source abstract
Abstract
Tin whisker growth has been observed since the 1950s and has become of more interest in the past 15 to 20 years due to the desire to use lead-free solders, pure tin being a good lead-free candidate. In the same time period, failure of satellites and other devices using pure tin solders has been blamed on tin whisker growth. The accepted driving force for whisker growth is compressive stresses in films. This article reports a microstructure-control method of limiting whisker growth through the introduction of pores that permit an alternate means of stress relief.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Metallurgical Processes and Thermodynamics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (19)
Show source-provided references
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