journal article·2007-10

Measuring residual stress in glasses and ceramics using instrumented indentation

T.E. Buchheit, R. Tandon

Journal of Materials Research· Volume 22· Issue 10
Publisher page

Abstract

Instrumented indentation has yielded mixed results when used to measure surface residual stresses in metal films. Relative to metals, many glasses and ceramics have a low modulus-to-yield strength (E/σy) ratio. The advantage of this characteristic for measuring residual stress using instrumented indentation is demonstrated by a series of comparative spherical and conical tip finite element simulations. Two cases are considered: (i) a material with E/σy = 24—similar to glass and (ii) a material with E/σy = 120—similar to metal films. In both cases, compressive residual stress shifts the simulated load–displacement response toward increasing hardness, irrespective of tip geometry. This shift is shown to be entirely due to pile up for the “metal” case, but primarily due to the direct influence of the residual stress for the “glass” case. Hardness changes and load–displacement curve shifts are explained by using the spherical cavity model. Supporting experimental results on stressed glasses are provided.
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Research context

OpenAlex topics: Metal and Thin Film Mechanics · Advanced Surface Polishing Techniques · Advanced machining processes and optimization

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (31)

Show source-provided references
1. 10.1007/BF0266500310.1007/BF02665003 ↗
2. 10.3139/146.02085710.3139/146.020857 ↗
3. 10.1016/j.mser.2004.05.00110.1016/j.mser.2004.05.001 ↗
4. 10.1080/1478643060060683410.1080/14786430600606834 ↗
5. 10.1557/JMR.1999.030610.1557/JMR.1999.0306 ↗
6. 22 Tandon R. Glass S.J. : Controlling the fragmentation behavior of stressed glass in Fracture Mechanics of Ceramics, Active Materials, Nanoscale Materials, Composites, Glass, and Fundamentals, Eighth International Symposium on Fracture Mechanics of Ceramics, Vol. 14, Houston, TX, (Feb. 2003), edited by R.C. Bradt, D. Munz, M. Sakai, and K.W. White (Springer) 2005 77–9110.1007/978-0-387-28920-5_7 ↗
7. 10.1111/j.1151-2916.1980.tb10768.x10.1111/j.1151-2916.1980.tb10768.x ↗
8. 10.1098/rspa.1989.005610.1098/rspa.1989.0056 ↗
9. 17 Johnson K.L. : Contact Mechanics, 4th ed., (Cambridge University Press, Cambridge, UK) 1985 Chap. 6
10. 10.1080/1478643060062727710.1080/14786430600627277 ↗
11. Taljat · 2000 · 594 · 519
12. 10.1557/JMR.1998.014610.1557/JMR.1998.0146 ↗
13. 10.1016/S1359-6454(01)00123-910.1016/S1359-6454(01)00123-9 ↗
14. 10.1016/S1359-6454(98)00226-210.1016/S1359-6454(98)00226-2 ↗
15. 10.1115/1.148575610.1115/1.1485756 ↗
16. 10.1557/JMR.1996.009110.1557/JMR.1996.0091 ↗
17. Ceramic packaging for MEMS-based microsystems.
18. 10.1557/JMR.2001.017910.1557/JMR.2001.0179 ↗
19. 10.1098/rspa.1999.042310.1098/rspa.1999.0423 ↗
20. 10.1016/j.msea.2005.10.03410.1016/j.msea.2005.10.034 ↗
21. 10.1098/rspa.1964.011410.1098/rspa.1964.0114 ↗
22. 10.1557/JMR.1996.009210.1557/JMR.1996.0092 ↗
23. 10.1557/JMR.2001.028610.1557/JMR.2001.0286 ↗
24. 10.1016/j.actamat.2005.01.00210.1016/j.actamat.2005.01.002 ↗
25. 10.1016/S0040-6090(03)01103-910.1016/S0040-6090(03)01103-9 ↗
26. 10.1007/978-0-387-22462-610.1007/978-0-387-22462-6 ↗
27. 10.1016/S1359-6454(01)00122-710.1016/S1359-6454(01)00122-7 ↗
28. 10.1557/jmr.2004.19.1.310.1557/jmr.2004.19.1.3 ↗
29. 10.1016/0020-7683(87)90116-810.1016/0020-7683(87)90116-8 ↗
30. 10.1111/j.1551-2916.2006.01389.x10.1111/j.1551-2916.2006.01389.x ↗
31. 10.1016/j.jmps.2005.04.00710.1016/j.jmps.2005.04.007 ↗