journal article·1998-10

Young's modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing

F. Macionczyk, W. Brückner, W. Pitschke, G. Reiss

Journal of Materials Research· Volume 13· Issue 10
Publisher page

Abstract

Force-strain curves were measured for 1.0 μm and 1.5 μm thick Cu0.57Ni0.42Mn0.01 films on 8 μm thick polyimide foils by tensile testing. By separating the force working on the polyimide foil from that working on the metal-polyimide compound, stress-strain curves for the CuNi(Mn) films were obtained. Young's modulus and tensile strength were determined for as-deposited and annealed [350 °C, 1 h, N2/H2(5 vol%) atmosphere] films by this method. Crack propagation starts at the end of the elastic region at 0.2 to 0.7% strain, depending on the film thickness and the thermal treatment. The cracking behavior is described by a steady-state approximation.
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Research context

OpenAlex topics: Numerical methods in engineering · Electronic Packaging and Soldering Technologies · Composite Structure Analysis and Optimization

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