Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers
Source abstract
Abstract
Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 μm thick, with individual layers systematically varied from 2.5 to 40 nm, were studied on Si substrates. Layers of Al and Ti were nominally equal in thickness, with actual composition determined for each specimen using energy dispersive spectroscopy. The thermal diffusivity both in the plane and normal to the plane of the films (thermal conductivity divided by specific heat per volume) was found to decrease significantly with decreasing bilayer thickness. Pure Ti and Al films as well as Cu films from 0.1 to 5 μm thick were also studied. In-plane electrical conductances of the Al/Ti multilayers were also measured.
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Research context
OpenAlex topics: Thermal properties of materials · Electronic Packaging and Soldering Technologies · Advanced Thermoelectric Materials and Devices
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