journal article·1992-09

Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems

J.S. Reid, E. Kolawa, M-A. Nicolet

Journal of Materials Research· Volume 7· Issue 9
Publisher page

Abstract

The room-temperature and 700 °C tie lines of the early transition metal–Si–Cu ternary systems have been calculated for the metals Cr, Mo, Nb, Ta, V, and W. The tie lines are determined by considering only binary and elemental phases in observance of strict stoichiometry and zero solid solubility. We find that copper is stable with the majority of transition metal silicides under consideration at 700 °C. The result is relevant to the design of stable copper metallizations for silicon.
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Research context

OpenAlex topics: Intermetallics and Advanced Alloy Properties · Metallurgical and Alloy Processes · Advanced materials and composites

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References (26)

Show source-provided references
1. 10.1016/0040-6090(82)90429-110.1016/0040-6090(82)90429-1 ↗
2. Massalski · 1991
3. Villars · 1985
4. 10.1016/0022-5088(76)90180-610.1016/0022-5088(76)90180-6 ↗
5. Barin · 1989
6. 10.1021/cr00102a00310.1021/cr00102a003 ↗
7. Chart · National Physical Laboratory, Report DCS · 1972 · 18
8. 10.1116/1.57765310.1116/1.577653 ↗
9. Kattelus · 1988
10. 10.1063/1.34959410.1063/1.349594 ↗
11. 10.1109/55.8207410.1109/55.82074 ↗
12. Reid · 1992 · 285
13. Kolawa · 1991
14. Jangg · Z. Metallk. · 1972 · 61 · 670
15. Barin · 1973
16. 10.1016/0364-5916(79)90020-810.1016/0364-5916(79)90020-8 ↗
17. 10.1016/0364-5916(87)90005-810.1016/0364-5916(87)90005-8 ↗
18. Lukas · CALPHAD · 1
19. 10.1063/1.10326010.1063/1.103260 ↗
20. 10.1007/BF0266988710.1007/BF02669887 ↗
21. 10.1016/0022-5088(75)90034-X10.1016/0022-5088(75)90034-X ↗
22. 10.1063/1.33373810.1063/1.333738 ↗
23. 10.1007/978-94-009-1027-0_610.1007/978-94-009-1027-0_6 ↗
24. 10.1007/3540104402_1010.1007/3540104402_10 ↗
25. 10.1007/BF0264413910.1007/BF02644139 ↗
26. Chart · High Temp.-High Press. · 1973 · 5 · 241