Rapid consolidation processing of silicon nitride powders

Using a Plasma Assisted Sintering (PAS) process, submicron size, silicon nitride powders were consolidated to >99% of the theoretical density (TD) at 1750 °C in less than 5 min with retention of the a phase and the submicron grain size. The silicon nitride powders were sintered with 5 wt.% Y₂O₃ and 5 wt.% Y₂O₃ + 5 wt. % MgAl₂O₄ additives. The PAS processing method for the silicon nitride additive mixtures is attractive for retention of fine-grained microstructures favorable for superplastic deformation. Post superplastic forming heat treatments to transform the α−Si₃N₄ to lath-like, creep-resistant β−Si₃N₄ is another feature of the present processing method.