Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys

This study investigated the characteristics of the intermetallics that appear in Sn–Zn–Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε–AgZn₃ and γ–Ag₅Zn₈. These Ag–Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300 °C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250 °C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300 °C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.