journal article·1998-11Open access

Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon

J. Koike, S. Utsunomiya, Y. Shimoyama, K. Maruyama, H. Oikawa

Journal of Materials Research· Volume 13· Issue 11

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Metal and Thin Film Mechanics · Semiconductor materials and interfaces · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (28)

Show source-provided references
1. C. J. Santoro, J. Electrochem. Soc. 116, 361 (1969).10.1149/1.2411847 ↗
2. W. B. Pennebaker, J. Appl. Phys. 40, 394 (1969).10.1063/1.1657067 ↗
3. P. Chaudhari, J. Appl. Phys. 45, 4339 (1974).10.1063/1.1663054 ↗
4. M. Ronay and C. F. Aliotta, Philos. Mag. A 42, 161 (1980).10.1080/01418618009365808 ↗
5. F. Ericson, N. Kristensen, and J-A. Schweitz, J. Vac. Sci. Technol. B9, 58 (1991).10.1116/1.585790 ↗
6. B. C. Martin, C. J. Tracy, J. W. Mayer, and L. E. Hendrickson, Thin Solid Films 271, 64 (1995).10.1016/0040-6090(95)06941-0 ↗
7. F. Y. Genin and W. J. Siekhaus, J. Appl. Phys. 79, 3560 (1996).10.1063/1.361408 ↗
8. F. G. Yost, Scripta Metall. 23, 1323 (1989).10.1016/0036-9748(89)90053-7 ↗
9. W. Tice and G. Slusser, J. Vac. Sci. Technol. B8, 106 (1990).10.1116/1.584854 ↗
10. M. A. Korhonen, C. A. Paszkiet, and C-Y. Li, J. Appl. Phys. 69, 8083 (1991).10.1063/1.347457 ↗
11. S. M. Hu, Appl. Phys. Lett. 59, 2685 (1991).10.1063/1.105884 ↗
12. R. W. Vook and F. Witt, J. Appl. Phys. 36, 2169 (1965).10.1063/1.1714442 ↗
13. A. K. Sinha and T. T. Sheng, Thin Solid Films 48, 117 (1978).10.1016/0040-6090(78)90337-1 ↗
14. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Elec. Dev. ED34, 689 (1987).10.1109/T-ED.1987.22981 ↗
15. D. S. Gardner and P. A. Flinn, J. Appl. Phys. 67, 1831 (1990).10.1063/1.345611 ↗
16. J-H. Jou and C-S. Chung, Thin Solid Films 235, 149 (1993).10.1016/0040-6090(93)90258-Q ↗
17. C. A. Volkert, C. F. Alofs, and J. R. Liefting, J. Mater. Res. 9, 1147 (1994).10.1557/JMR.1994.1147 ↗
18. M. Murakami, Thin Solid Films 55, 101 (1978).10.1016/0040-6090(78)90078-0 ↗
19. V. M. Koleshko, V. F. Belitsky, and I. V. Kiryushin, Thin Solid Films 142, 199 (1986).10.1016/0040-6090(86)90005-2 ↗
20. G. G. Stoney, Proc. R. Soc. London, Ser. A 82, 172 (1909).10.1098/rspa.1909.0021 ↗
21. P. H. Townsend, D. M. Barnett, and T. A. Brunner, J. Appl. Phys. 62, 4438 (1987).10.1063/1.339082 ↗
22. A. Witvrouw, J. Proost, B. Deweerdt, Ph. Roussel, and K. Maex, in Thin Films: Stresses and Mechanical Properties V, edited by S. P. Baker, C. A. Ross, P. H. Townsend, C. A. Volkert, and P. Børgesen (Mater. Res. Soc. Symp. Proc. 356, Pittsburgh, PA, 1995), p. 441.10.1557/PROC-356-441 ↗
23. N. Kristensen, F. Ericson, and J-A. Schweitz, Thin Solid Films 197, 67 (1991); J. Appl. Phys. 69, 2097 (1991).10.1016/0040-6090(91)90222-J ↗
24. H. J. Frost and M. F. Ashby, Deformation Mechanism Maps (Pergamon Press, Oxford, 1982).
25. M. D. Thouless, J. Gupta, and J. M. E. Harper, J. Mater. Res. 8, 1845 (1993).10.1557/JMR.1993.1845 ↗
26. L. B. Freund, J. Appl. Phys. 68, 2073 (1990).10.1063/1.346560 ↗
27. V. T. Gillard, W. D. Nix, and L. B. Freund, J. Appl. Phys. 76, 7280 (1994).10.1063/1.358013 ↗
28. D. Jossel, Acta Metall. Mater. 42, 1031 (1994).10.1016/0956-7151(94)90297-6 ↗