Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints
Source abstract
Abstract
The microstructure and adhesion strength of the Sn–0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn–3.5Ag alloy, the Sn–0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular η-phase grew into a round and scallop-shaped morphology, thin є(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (16)
Show source-provided references
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