Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application
Source abstract
Abstract
The present study aims to develop a systematic processing route using direct ink writing (DIW) and pressureless sintering for fabricating hierarchically porous( ext{ Cu })(HP-( ext{ Cu })) electrodes. A 3D printable high particle loading( ext{ Cu })ink(> 95 { ext{wt}}\%)with polylactic acid as a binder was prepared. Green({ ext{Cu}})samples using optimum value of( ext{ Cu })loading, nozzle diameter, layer height, and printing speed as 97({ ext{wt}}\%), 0.2( ext{mm}), 70% and 10( ext{mm}/ ext{s})respectively were fabricated and subsequently sintered. A proper inter-particle bonding with 91% relative density and 215( ext{Mpa})ultimate compressive strength was achieved. Finally, a proof-of-concept study targeting the fabrication of thin HP-( ext{ Cu })current collector was performed and the pore size of 154 ± 10 µm with a thickness of 200 µm was achieved successfully. Moreover, the prepared sample exhibited the highest coulombic efficiency of 95.86% for more than 400 h at 1({ ext{mAcm}}-2)making it a potential candidate for energy storage applications.Graphical abstract
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Supercapacitor Materials and Fabrication · Advanced Sensor and Energy Harvesting Materials · Nanoporous metals and alloys
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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