journal article·2012-06-28

Effect of humidity on tin whisker growth from Sn₃Nd intermetallic compound

Ai-Ping Xian, Meng Liu

Journal of Materials Research· Volume 27· Issue 12

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Abstract

Abstract

Only a short abstract or summary was supplied by the source.

Source: crossref · Quality: short

Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Metallurgical and Alloy Processes

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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