Improved wettability of Sn-based solder over the Cu₆₀Zr₃₀Ti₁₀bulk metallic glass surface

The wettability of Pb-free Sn-based solder over the Cu-based Cu₆₀Zr₃₀Ti₁₀bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrO_xformed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu₆₀Zr₃₀Ti₁₀surface. The Ag-covered Cu₆₀Zr₃₀Ti₁₀surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu₆₀Zr₃₀Ti₁₀surface for the Sn-based solder was greatly improved.