Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding
Source abstract
Abstract
In this paper, the microstructure and the shear property of Cu/In–45Cu/Ni solder joints by transient liquid phase were studied, and the intermetallic compounds (IMCs) growth mechanism was investigated. The results showed that the IMCs volume ratio of solder joints was increased firstly and then decreased with increasing bonding time, and the IMCs volume ratio reached its maximum value of 95.8% at 60 min. The Cu interfacial IMC of the solder joint with dense microstructure was Cu2In phase at 60 min, and the Ni interfacial IMC was Ni3In7. The maximum shear strength of solder joints was obtained at 60 min, which is 15.21 MPa. The shear fracture appeared honeycomb structure, and the fracture occurred at the phase interface of Ni3In7/Cu11In9. The thickness of the interfacial IMCs and the white IMCs around the Cu particles (Cu@IMC) was increased continuously with increasing bonding time, and thus, the interconnection of Cu–Ni substrates was realized ultimately.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (42)
Show source-provided references
1. 10.1007/s11664-009-0723-510.1007/s11664-009-0723-5 ↗
2. 10.1007/s11664-005-0239-610.1007/s11664-005-0239-6 ↗
3. 10.1016/j.jallcom.2015.02.08810.1016/j.jallcom.2015.02.088 ↗
4. 10.4028/www.scientific.net/AMR.367.28710.4028/www.scientific.net/AMR.367.287 ↗
5. 10.1063/1.486333610.1063/1.4863336 ↗
6. 10.1016/j.ijplas.2008.09.00210.1016/j.ijplas.2008.09.002 ↗
7. The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures
8. 10.1016/j.scriptamat.2015.07.03610.1016/j.scriptamat.2015.07.036 ↗
9. 10.1002/zaac.20080027510.1002/zaac.200800275 ↗
10. 10.1080/09500839.2011.57505110.1080/09500839.2011.575051 ↗
11. Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles
12. 10.4028/www.scientific.net/KEM.795.36110.4028/www.scientific.net/KEM.795.361 ↗
13. 10.1007/s10853-016-0613-110.1007/s10853-016-0613-1 ↗
14. 10.1016/j.scriptamat.2015.08.01110.1016/j.scriptamat.2015.08.011 ↗
15. 10.1016/j.jallcom.2019.01.38410.1016/j.jallcom.2019.01.384 ↗
16. 10.1016/j.scriptamat.2012.01.04610.1016/j.scriptamat.2012.01.046 ↗
17. 10.1108/0954091091092826510.1108/09540910910928265 ↗
18. 10.1016/j.scriptamat.2009.06.02410.1016/j.scriptamat.2009.06.024 ↗
19. 10.1016/j.actamat.2017.03.06810.1016/j.actamat.2017.03.068 ↗
20. Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices
21. 10.1007/BF0264857110.1007/BF02648571 ↗
22. 10.1007/BF0264698110.1007/BF02646981 ↗
23. 10.1016/j.scriptamat.2015.07.03210.1016/j.scriptamat.2015.07.032 ↗
24. Enhancing the solid/liquid interfacial metallurgical reaction of Sn + Cu composite solder by ultrasonic-assisted chip attachment10.1016/j.jallcom.2019.01.090 ↗
25. Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints
26. Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures10.1016/j.msea.2017.08.099 ↗
27. 10.1016/j.calphad.2018.05.00410.1016/j.calphad.2018.05.004 ↗
28. Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid–liquid interdiffusion bonding
29. 10.1016/S0925-8388(00)00903-810.1016/S0925-8388(00)00903-8 ↗
30. 10.1016/j.matlet.2016.10.00610.1016/j.matlet.2016.10.006 ↗
31. 29. Chen, L.D. , Huang, M.L. , and Zhou, S.M. : Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects. In 60th Electronic Components and Technology Conference (ECTC) (IEEE: Las Vegas, NV, USA, 2010).
32. 10.1016/j.tsf.2018.04.03910.1016/j.tsf.2018.04.039 ↗
33. 10.1007/s11664-008-0582-510.1007/s11664-008-0582-5 ↗
34. 10.1016/j.apsusc.2010.03.09710.1016/j.apsusc.2010.03.097 ↗
35. 10.1557/jmr.2016.4510.1557/jmr.2016.45 ↗
36. 10.1007/s11664-014-3373-110.1007/s11664-014-3373-1 ↗
37. 10.1016/j.matlet.2016.10.01710.1016/j.matlet.2016.10.017 ↗
38. Effect of Zn content on Cu–Ni cross-interaction in Cu/Sn–xZn/Ni micro solder joints
39. 10.1016/j.apsusc.2018.05.12710.1016/j.apsusc.2018.05.127 ↗
40. Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test
41. 10.1016/j.intermet.2014.12.00210.1016/j.intermet.2014.12.002 ↗
42. 10.1007/s11664-012-2060-310.1007/s11664-012-2060-3 ↗