Evaluation of the microstructure and whisker growth in Sn–Zn–Ga solder with Pr content
Source abstract
Abstract
In spite of previous reports documented that many beneficial effects can be obtained by adding rare earth (RE) elements to Pb-free solders, this paper presents the risk of Sn whisker growth in the Sn–9Zn–0.5Ga Pb-free solders due to the addition of RE Pr. Results showed that solder microstructures are refined with the addition of trace amount of Pr. However, excessive Pr addition led to the formation of Pr–Sn intermetallic compounds (IMCs) and spontaneous growth of Sn whiskers on the IMC surfaces. It was found that the IMC size has a dramatic impact on whisker growth. Sn whiskers grew in slow-cooled solder with larger IMC particles are much longer and more prolific than that in fast-cooled solder with smaller IMC size. It was proposed that the driving force for whisker growth is originated from the oxidation of the RE-rich Pr–Sn IMCs. Our results indicated that the effects of RE on Pb-free solders should be reevaluated.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (47)
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