Measurement of the force required to move ceria particles from SiO2 surfaces using lateral force microscopy
Source abstract
Abstract
Cleaning of surfaces polished with ceria particles is achieved using brush scrubbing. In the presence of additives like proline, this becomes more challenging. Here, we quantified the force required to move ceria particle (FLM) from a SiO2surface using lateral force microscopy. The measurements were performed on ceria particles on polished and dipped SiO2films with and without proline as an additive in the ceria slurries. The adhesion of ceria particles on a polished surface is about twice as strong as that of ceria particles on a surface contaminated by dipping in the slurry. The ceria particles modified with proline are the most challenging to remove from the SiO2surface (100–255 nN ofFLM). Once the Ce–O–Si bonds between the ceria particle and SiO2surface are broken, the particle can be easily moved during the subsequent manipulations by applying ~ 21 nN. We also demonstrated that after brush cleaning with DI water for 5–15 s, the averageFLMof residual particles is lower by ~ 40 nN.Graphical abstract
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Force Microscopy Techniques and Applications · Diamond and Carbon-based Materials Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (37)
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