journal article·2014-01-28

Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

Wei-Hsun Chen, Pylin Sarobol, John R. Holaday, Carol A. Handwerker, John E. Blendell

Journal of Materials Research· Volume 29· Issue 2
Publisher page

Abstract

A strategy for identifying the preferred sites and overall propensity of a Sn film to form whiskers has been developed based on film textures, local grain orientations, and elastic strain energy densities (ESEDs), with preferred sites predicted to be grains with local high ESEDs. Using β-Sn films with various textures, ESED distributions were simulated for elastic and thermoelastic stresses depending on isothermal aging or thermal cycling conditions. Local high ESEDs are preferentially induced in (110) or (100) oriented grains with c-axes nearly parallel to the film plane; films with overall low ESEDs have strong (100) textures for elastic stresses and strong (001) textures for thermoelastic stresses, suggesting low propensities to form whiskers. This work establishes a model for understanding the effect of the β-Sn anisotropy on whisker formation and provides guidelines for testing whether engineering specific film textures will reduce a film’s propensity to form whiskers.
Source: expertdata · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · 3D IC and TSV technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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