DataVXJournal of Materials ResearchPaper
journal article·2009-02

A new solder wetting layer for Pb-free solders

Chang Yul Oh, Hee-Ra Roh, Young Min Kim, Jin Soo Lee, Hae Young Cho, Young-Ho Kim

Journal of Materials Research· Volume 24· Issue 2
Publisher page
Source abstract

Abstract

We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.
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Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Copper Interconnects and Reliability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (20)

Show source-provided references
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