Interactions between lead oxide and ceramic substrates for thick film technology
Source abstract
Abstract
This paper deals with the mechanisms and kinetics of interactions between screen printed and fired PbO layers and ceramic substrates: alumina and beryllia. The interaction with alumina occurs via two main processes: (i) a reaction between PbO and Al2O3 grains, which induces the formation of a crystalline phase, Pb2Al2O5; and (ii) an interdiffusion process involving Pb and the intergranular amorphous phase in the ceramic substrate. This latter process results in a compositional change of the intergranular phase at considerable depths inside the ceramic substrate, as well as in the formation of a high lead glass layer on the substrate surface. Since PbO is not completely reacted, the Pb penetration in the ceramic is diffusion limited (penetration depth , where td is the reaction time) with an activation energy of 1.20 ± 0.05 eV. The ceramic microstructure significantly affects the interaction processes.
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Research context
OpenAlex topics: Electrical and Thermal Properties of Materials · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
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References (17)
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