DataVXJournal of Materials ResearchPaper
journal article·2007-09

Study of Ru barrier failure in the Cu/Ru/Si system

M. Damayanti, T. Sritharan, S.G. Mhaisalkar, E. Phoon, L. Chan

Journal of Materials Research· Volume 22· Issue 9
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Source abstract

Abstract

The reaction mechanisms and related microstructures in the Cu/Si, Ru/Si, and Cu/Ru/Si metallization system were studied experimentally. With the help of sheet resistance measurements, x-ray diffraction, field-emission scanning electron microscopy, secondary ion mass spectroscopy, and transmission electron microscopy, the metallization structure with Ru barrier layer was observed to fail completely at temperatures around 700 °C, regardless of the Ru thickness because of the formation of polycrystalline Ru2Si3 followed by Cu3Si protrusions.
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Research context

OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and interfaces · Microstructure and mechanical properties

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References (18)

Show source-provided references
1. 18JCPDS No. 32-0978. International Center for Diffraction Data American Ceramic Society, Swarthmore, PA, 1981
2. 10.1063/1.216761010.1063/1.2167610 ↗
3. Damascene copper electroplating for chip interconnections.
4. 10.1149/1.156513810.1149/1.1565138 ↗
5. 17 JCPDS No. 06-0663. International Center for Diffraction Data American Ceramic Society, Swarthmore, PA, 1981
6. 10.1063/1.161025610.1063/1.1610256 ↗
7. 11JCPDS No. 04-0836. International Center for Diffraction Data American Ceramic Society, Swarthmore, PA, 1981
8. 10.1016/S0040-6090(01)01353-010.1016/S0040-6090(01)01353-0 ↗
9. 10.1149/1.178405110.1149/1.1784051 ↗
10. 5 Massalski T.B. : Cu-Ru phase diagram, in Binary Alloy Phase Diagrams 2nd ed. edited by T.B. Massalki and H. Okamoto (American Society of Metals, Materials Park, OH, 1990), p. 1467
11. 10.1149/1.175711310.1149/1.1757113 ↗
12. 10.1149/1.160527110.1149/1.1605271 ↗
13. 10.1149/1.218832810.1149/1.2188328 ↗
14. 10.1063/1.37135710.1063/1.371357 ↗
15. 13JCPDS No. 23-0224. International Center for Diffraction Data American Ceramic Society, Swarthmore, PA, 1981
16. 10.1016/S0040-6090(99)00055-310.1016/S0040-6090(99)00055-3 ↗
17. 10.1063/1.33131910.1063/1.331319 ↗
18. 10.1149/1.142134810.1149/1.1421348 ↗