Study of Stresses in Thin Silicon Wafers with Near-infraredphase Stepping Photoelasticity
Source abstract
Abstract
This paper reports on a study of stress in thin silicon plates sectioned from wafers by a near-infrared transmission technique. Phase stepping was incorporated to determine the magnitude and orientation of stress from fractional birefringence fringe images. The anisotropic relative optic-stress coefficient of (100) silicon was determined and the limitation of the stress orientation measurement is discussed.
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Research context
OpenAlex topics: Optical measurement and interference techniques · Advanced Surface Polishing Techniques · Advanced MEMS and NEMS Technologies
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References (21)
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1. Shimaoka · J. Non-destructive Inspection, · 1987 · 36 · 901
2. Date · 1992 · 985
3. 10.1016/0022-0248(87)90164-310.1016/0022-0248(87)90164-3 ↗
4. 10.1016/0022-0248(80)90021-410.1016/0022-0248(80)90021-4 ↗
5. Kobayashi · 1993
6. Bond · Lett. Phys. · 1956 · 1211
7. 10.1016/0143-8166(94)90067-110.1016/0143-8166(94)90067-1 ↗
8. Zheng T. , Ph.D. Dissertation, Georgia Institute of Technology, Atlanta, GA (2000).
9. Haake S.J. and Patterson E.A. , Strain Nov., 153 (1992).10.1111/j.1475-1305.1992.tb00812.x ↗
10. Campbell · 1996
11. 10.1016/S0143-8166(96)00060-710.1016/S0143-8166(96)00060-7 ↗
12. Niitsu · 1994 · 187 · 29
13. 10.1063/1.173502610.1063/1.1735026 ↗
14. Niitsu · 1994 · 187 · 37
15. 10.1016/0022-0248(83)90068-410.1016/0022-0248(83)90068-4 ↗
16. 10.1016/0143-8166(94)00024-510.1016/0143-8166(94)00024-5 ↗
17. 10.1063/1.165976310.1063/1.1659763 ↗
18. 10.1002/pssa.221106020610.1002/pssa.2211060206 ↗
19. 10.1007/978-1-4757-0025-110.1007/978-1-4757-0025-1 ↗
20. Kuske · 1974
21. 10.1063/1.35101710.1063/1.351017 ↗