Joining of Ti₃SiC₂ with Ti–6Al–4V Alloy

The joining of a Ti₃SiC₂ ceramic with a Ti–6Al–4V alloy was carried out at the temperature range of 1200–1400 °C for 15 min to 4 h in a vacuum. The total diffusion path of joining was determined to be Ti₃SiC₂/Ti₅Si₃C_x/Ti₅Si₃C_x + TiC_x/TiC_x/Ti. The reaction was rate controlled by the solid-state diffusion below 1350 °C and turned to the liquid-state diffusion controlled with a dramatic increase of parabolic rate constant K_p when the temperature exceeded 1350 °C. The TiC_x tended to grow at the boundarywith the Ti–6Al–4V alloy at a higher temperature and longer holding time. TheTi₃SiC₂/Ti–6Al–4V joint is expected to be applied to implant materials.