Fabrication of iron carbide by plasma-enhanced atomic layer deposition
Source abstract
Abstract
Iron carbide (Fe1−xCx) thin films were successfully grown by plasma-enhanced atomic layer deposition (PEALD) using bis(N, N′-di-tert-butylacetamidinato)iron(II) as a precursor and H2plasma as a reactant. Smooth and pure Fe1−xCxthin films were obtained by the PEALD process in a layer-by-layer film growth fashion, and thexin the nominal formula of Fe1−xCxis approximately 0.26. For the wide PEALD temperature window from 80 to 210 °C, a saturated film growth rate of 0.04 nm/cycle was achieved. X-ray diffraction and transition electron microscope measurements show that the films grown at deposition temperature 80–170 °C are amorphous; however, at 210 °C, the crystal structure of Fe7C3is formed. The conformality and resistivity of the deposited films have also been studied. At last, the PEALD Fe1−xCxon carbon cloth shows excellent electrocatalytic performance for hydrogen evolution.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Semiconductor materials and devices · Diamond and Carbon-based Materials Research · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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