Damage behavior of Cu–Ta bilayered films under cyclic loading

Damage behavior of Cu–Ta bilayered films bonded to polyimide (PI) substrates has been investigated by cyclic loading tests. Experimental results show that fatigue cracks preferentially initiated in the Ta layer close to the Ta–PI interface and propagated into the Cu layer perpendicular to the interface. The alignment of nanometer-sized Cu grains resulted from the potential GB sliding combined with a small amount of grain rotation was found in the damage zone ahead of the crack tip, and that is suggested to be a likely damage mechanism to accommodate cyclic plastic strain ahead of the fatigue crack tip of the submicrometer-thick Cu layer.