journal article·1991-05

Stable, highly concentrated suspensions for electronic and ceramic materials applications

I. Sushumna, R.K. Gupta, E. Ruckenstein

Journal of Materials Research· Volume 6· Issue 5
Publisher page

Abstract

Highly concentrated solid-in-liquid suspensions find applications in a number of areas such as electronics, ceramics, paints, coatings, etc. Highly loaded, stable suspensions which exhibit desirable rheological characteristics (moderate viscosity, shear thinning behavior, thixotropy, and a small yield stress, for example), and which have high thermal or electrical conductivities are frequently sought after. We describe here some techniques which can be used to obtain such highly concentrated suspensions. These involve employing mixed size grades of particles and effective dispersants. For thermal paste applications, for example, compliant pastes of up to 78 vol. % solids with thermal conductivity values as high as 6 W/mK (hence, a few times greater than the values reported previously by others), low electrical conductivity, and moderate viscosity have been prepared by mixing different particle size grades of materials such as Al2O3, SiC, AlN, Al, and diamond. Effective dispersants, both commercial as well as those synthesized in our laboratory as novel variations of previously known molecular architectures, have been used to facilitate the achievement of these very high loading and stable suspensions.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Ferroelectric and Piezoelectric Materials · Concrete and Cement Materials Research · Electrophoretic Deposition in Materials Science

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (16)

Show source-provided references
1. 15 Rajaiah J. , Gupta R. K. , and Ruckenstein E. (in preparation).
2. 10.1016/0255-2701(87)80025-910.1016/0255-2701(87)80025-9 ↗
3. Churchill · 1986 · 4 · 394
4. Weast · 1981
5. Lien · European Patent 0 · 1986 · 114 · 000
6. Aakalu · U.S. Patent 4 · 1981 · 265 · 775
7. 1 Zwick J. W. , in Proc. 4th Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, 88 (1988).
8. 16 Sushumna I. , Gupta R. K. , and Ruckenstein E. (submitted).
9. 6 Richard R. G. , Gupta R. K. , and Andrews G. F. , paper presented at the AIChE Annual Meeting, New York (1987).
10. Meredith · 1962 · 2 · 15
11. 10.2514/3.2946210.2514/3.29462 ↗
12. 9 Rajaiah J. , Andrews G. F. , Gupta R. K. , and Ruckenstein E. (in preparation).
13. 10.1016/S0065-2717(08)70119-910.1016/S0065-2717(08)70119-9 ↗
14. 10.1002/andp.1935416070510.1002/andp.19354160705 ↗
15. 10.1002/pen.76016090510.1002/pen.760160905 ↗
16. Wright · U. S. Patent 3 · 1975 · 885 · 984