Structure of composition-modulated Cu/Ni thin films prepared by electrodeposition
Source abstract
Abstract
Copper/nickel multilayered thin-films prepared by electrodeposition have been examined in cross section by electron energy loss spectroscopy and high-resolution transmission electron microscopy. The results of the examinations provide the first direct experimental evidence of the large composition modulation across successive layers in the thin-film structure and the coherent nature of Cu/Ni interfaces.
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Research context
OpenAlex topics: Copper Interconnects and Reliability · Electrodeposition and Electroless Coatings · Semiconductor materials and devices
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References (10)
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