Cruciform pattern formation in Sn/Co couples
Source abstract
Abstract
CoSn3phase is formed in Sn/Co couples reacted at 200 °C. The reaction phase shows a unique cruciform pattern that is observed for the first time in the solid/solid reaction. The reaction phase layers are thick and uniform along the edges of the Co substrate, and there are no reaction phases at the corners. A continuous reaction layer is formed in Sn/Co couples reacted at 180 °C. A metastable CoSn4phase is formed at the corner, and the reaction phase along the edge of the Co substrate is the CoSn3phase. The reaction CoSn3phase region shows a cruciform pattern if the CoSn4phase region is ignored. It is concluded that the Sn flux is much faster than the Co flux, and the cruciform pattern of the reaction CoSn3phase layer is formed either by cracking or transformation to the CoSn4phase at the corners where stresses are most intensified.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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