Plastic deformation processes in Cu/Sn bimetallic films
Source abstract
Abstract
Although the driving force for the growth of Sn whiskers from the surface of Sn coatings on copper is thought to be internally generated stress due to the formation of Cu6Sn5at the Cu/Sn interface, little is known about the nature of this internal stress and how it cracks the surface Sn oxide (an important precursor to whisker formation). Arguments based on elasticity alone do not appear to be sufficient and suggest an important role for plastic deformation. Direct observations, made by transmission electron microscopy of cross-sectioned bimetallic Cu/Sn thin-film specimens, confirm plastic deformation of the Sn grains due to the formation of Cu6Sn5. Dislocation motion and pile-up at the surface Sn oxide, rotation associated with subgrain boundary formation, interaction of the subgrain boundaries with the Sn surface, and diffusional processes are various mechanisms that can produce stress at the Sn surface and crack the Sn oxide.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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